Low-loss 4 × 2 channels polymer optical waveguide with circular graded-index cores for high-density integration on printed circuit boards

Yusuke Takeyoshi, Kotaro Matsumoto, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

For high-speed and high-density optical interconnections on boards, we propose and demonstrate a novel parallel polymer waveguide with circular cores in which parabolic graded refractive index (GI) profiles are formed. This new waveguide exhibits very low loss (0.029 dB/cm at 850 nm) and high bandwidth (83 Gbps/ch for 1 m) due to the GI profile. We also theoretically and experimentally demonstrate the possibility of higher-density integration of waveguides by allowing for the tolerance for the misalignment between VCSELs and waveguides, compared with the SI waveguides. In addition, we demonstrate that the GI cores can dramatically decrease the inter-channel crosstalk.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages2111-2116
Number of pages6
DOIs
Publication statusPublished - 2008 Sep 15
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 2008 May 272008 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period08/5/2708/5/30

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Takeyoshi, Y., Matsumoto, K., & Ishigure, T. (2008). Low-loss 4 × 2 channels polymer optical waveguide with circular graded-index cores for high-density integration on printed circuit boards. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 2111-2116). [4550277] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550277