Low Loss Channel-Shuffling Polymer Waveguides: Design and Fabrication

Kohei Abe, Yutaro Oizumi, Yoichi Taira, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, we demonstrate that low insertion loss is achieved in channel-shuffling polymer waveguide having graded-index (GI) square cores (24 channels × 24 channels) with a 125-mm interchannel pitch. Although there are several fabrication methods for GI-core polymer optical waveguides proposed, the index profiles formed in the square cores are not ideally symmetric, when conventional photo-lithography method is applied. Hence, we apply the imprint method for the GI square core polymer waveguides with ideally symmetric index profile. First, we design the structure of channel-shuffling waveguide to exhibit low insertion loss, and then experimentally fabricate the waveguide.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages526-531
Number of pages6
ISBN (Electronic)9781509043323
DOIs
Publication statusPublished - 2017 Aug 1
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: 2017 May 302017 Jun 2

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period17/5/3017/6/2

Keywords

  • Channel-shuffling
  • Graded-index
  • Imprint method
  • Optical interconnect
  • Polymer optical waveguide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Abe, K., Oizumi, Y., Taira, Y., & Ishigure, T. (2017). Low Loss Channel-Shuffling Polymer Waveguides: Design and Fabrication. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017 (pp. 526-531). [7999740] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2017.223