Low-Power and wideband inductive-coupling communication for 3D integration

Noriyuki Miura, Tadahiro Kuroda

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	174-181
Number of pages	8
Journal	Journal of Japan Institute of Electronics Packaging
Volume	11
Issue number	3
DOIs	https://doi.org/10.5104/jiep.11.174
Publication status	Published - 2008 May 1

Cite this

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title = "Low-Power and wideband inductive-coupling communication for 3D integration",

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