| Original language | English |
|---|---|
| Pages (from-to) | 174-181 |
| Number of pages | 8 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 11 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2008 May |
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Communication
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Low-Power and wideband inductive-coupling communication for 3D integration. / Miura, Noriyuki; Kuroda, Tadahiro.
In: Journal of Japan Institute of Electronics Packaging, Vol. 11, No. 3, 05.2008, p. 174-181.Research output: Contribution to journal › Article
Miura, N & Kuroda, T 2008, 'Low-Power and wideband inductive-coupling communication for 3D integration', Journal of Japan Institute of Electronics Packaging, vol. 11, no. 3, pp. 174-181. https://doi.org/10.5104/jiep.11.174
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