Original language | English |
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Pages (from-to) | 174-181 |
Number of pages | 8 |
Journal | Journal of Japan Institute of Electronics Packaging |
Volume | 11 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2008 May |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Low-Power and wideband inductive-coupling communication for 3D integration. / Miura, Noriyuki; Kuroda, Tadahiro.
In: Journal of Japan Institute of Electronics Packaging, Vol. 11, No. 3, 05.2008, p. 174-181.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Low-Power and wideband inductive-coupling communication for 3D integration
AU - Miura, Noriyuki
AU - Kuroda, Tadahiro
PY - 2008/5
Y1 - 2008/5
UR - http://www.scopus.com/inward/record.url?scp=84871078648&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84871078648&partnerID=8YFLogxK
U2 - 10.5104/jiep.11.174
DO - 10.5104/jiep.11.174
M3 - Article
AN - SCOPUS:84871078648
VL - 11
SP - 174
EP - 181
JO - Journal of Japan Institute of Electronics Packaging
JF - Journal of Japan Institute of Electronics Packaging
SN - 1343-9677
IS - 3
ER -