Low-Power and wideband inductive-coupling communication for 3D integration

Noriyuki Miura, Tadahiro Kuroda

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)174-181
Number of pages8
JournalJournal of Japan Institute of Electronics Packaging
Volume11
Issue number3
DOIs
Publication statusPublished - 2008 May

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Communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Low-Power and wideband inductive-coupling communication for 3D integration. / Miura, Noriyuki; Kuroda, Tadahiro.

In: Journal of Japan Institute of Electronics Packaging, Vol. 11, No. 3, 05.2008, p. 174-181.

Research output: Contribution to journalArticle

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