Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells

Mizuhisa Nihei, Daiyu Kondo, Akio Kawabata, Shintaro Sato, Hiroki Shioya, Mamoru Sakaue, Taisuke Iwai, Mari Ohfuti, Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

103 Citations (Scopus)

Abstract

We have succeeded in lowering the resistance of multi-walled carbon nanotube (MWNT) vias, using parallel channel conduction of each tube's inner shells. By optimizing the structure of the interface between MWNTs and Ti bottom contact layers, we could obtain a via resistance of 0.7 Ω for a 2-μm-diameter via consisting of about 1000 MWNTs. The corresponding resistance of about 0.7 kΩ per MWNT indicates that most of the inner shells contribute to carrier conduction as an additional channel. The total resistance of the CNT vias that we fabricated is in the same order of magnitude as the theoretical value of W plugs and one order of magnitude higher than the theoretical value of Cu vias.

Original languageEnglish
Title of host publicationProceedings of the IEEE 2005 International Interconnect Technology Conference, IITC
Pages234-236
Number of pages3
Publication statusPublished - 2005 Dec 7
Externally publishedYes
EventIEEE 2005 International Interconnect Technology Conference, IITC - Burlingame, CA, United States
Duration: 2005 Jun 62005 Jun 8

Publication series

NameProceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Other

OtherIEEE 2005 International Interconnect Technology Conference, IITC
CountryUnited States
CityBurlingame, CA
Period05/6/605/6/8

ASJC Scopus subject areas

  • Engineering(all)

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    Nihei, M., Kondo, D., Kawabata, A., Sato, S., Shioya, H., Sakaue, M., Iwai, T., Ohfuti, M., & Awano, Y. (2005). Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells. In Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC (pp. 234-236). [12.2] (Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC).