Low temperature grown carbon nanotube interconnects using inner shells by chemical mechanical polishing

Daisuke Yokoyama, Takayuki Iwasaki, Tsuyoshi Yoshida, Hiroshi Kawarada, Shintaro Sato, Takashi Hyakushima, Mizuhisa Nihei, Yuji Awano

Research output: Contribution to journalArticle

102 Citations (Scopus)

Abstract

Vertically aligned multiwalled carbon nanotubes (MWCNTs) were synthesized by remote plasma chemical vapor deposition at a low temperature of 390 °C, which meets the requirement of the large scale integration (LSI) process. For wiring application, we measured the electrical properties of MWCNT-via structures with and without chemical mechanical polishing (CMP). The via resistances were reduced using inner shells of MWCNTs whose caps were opened due to CMP. The improved resistance after annealing at 400 °C was 0.6 for 2 μm vias. Our process is suitable for LSI because the temperature never exceeds the allowable temperature of 400 °C in the Si LSI process.

Original languageEnglish
Article number263101
JournalApplied Physics Letters
Volume91
Issue number26
DOIs
Publication statusPublished - 2007 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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