Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

N. Shishido, S. Kamiya, C. Chen, H. Sato, K. Koiwa, Masaki Omiya, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Macroscopic and microscopic adhesion strength of damascene interconnects was investigated by evaluating local strength through delaminating different scales of adhesion area under SEM observation. Macroscopic strength obtained by the areas larger than the copper grain was almost constant after considering the macroscopic plastic deformation. However, microscopic strength obtained by the areas smaller than the copper grain spread around the macroscopic strength and was highly sensitive to the copper grain structure, especially the grain boundary.

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
DOIs
Publication statusPublished - 2013
Event2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan
Duration: 2013 Jun 132013 Jun 15

Other

Other2013 16th IEEE International Interconnect Technology Conference, IITC 2013
CountryJapan
CityKyoto
Period13/6/1313/6/15

    Fingerprint

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

Cite this

Shishido, N., Kamiya, S., Chen, C., Sato, H., Koiwa, K., Omiya, M., ... Suzuki, T. (2013). Macroscopic and microscopic interface adhesion strength of copper damascene interconnects. In Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013 [6615564] https://doi.org/10.1109/IITC.2013.6615564