Measurement of copper thin film adhesion by multi-stages peel test

M. Omiya, K. Kishimoto, H. Inoue, M. Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Multi-layer thin films are widely used in micro-sensor and microelectronics products. These electronic devices contain several metal or polymer thin films and reliability of these systems is strongly dependent on interfacial adhesion of thin films. Due to the thermal stress, residual stress or elastic mismatch, the delamination between layers sometimes occurs. Therefore, it is important to evaluate the interfacial strength precisely. Peel tests are simple way to estimate an interfacial strength and, in fact, widely used in industrial field. Recently, a new simple but functional device for peel tests has developed in our group. This test method is called "Multi-stages peel test". There are two features in this device. At first, peeling tips can be observed continually and it becomes easy to measure a peeling angle. Second is that the peeling angle can be varied by attaching dead weights on the specimen. This dead weight works as a shear force at the peeling tip and the peeling angle can be changed variously. Therefore, the fracture tests under the various phase angles are possible. In this paper, Multi-stages peel test is applied to the evaluation of interface strength of multi-layer thin films that are composed of Cu, Cr, PI and Si layers. By considering the energy balance at the steady-state peeling, the interfacial strength can be obtained. When the thickness of Cu film is too thin, the delamination of under layers sometimes occurs and it enhances the interfacial strength of Cu/Cr interface.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages472-477
Number of pages6
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Externally publishedYes
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan, Province of China
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan, Province of China
CityKaohsiung
Period02/12/402/12/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)

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  • Cite this

    Omiya, M., Kishimoto, K., Inoue, H., & Amagai, M. (2002). Measurement of copper thin film adhesion by multi-stages peel test. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 472-477). [1188885] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188885