Measurement of copper thin film adhesion by multi-stages peel test

M. Omiya, K. Kishimoto, H. Inoue, M. Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Fingerprint Dive into the research topics of 'Measurement of copper thin film adhesion by multi-stages peel test'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science