Mechanical polishing technique for carbon nanotube interconnects in ULSIs

Masahiro Horibe; Mizuhisa Nihei; Daiyu Kondo; Akio Kawabata; Yuji Awano

doi:10.1143/JJAP.43.6499

Mechanical polishing technique for carbon nanotube interconnects in ULSIs

Masahiro Horibe, Mizuhisa Nihei, Daiyu Kondo, Akio Kawabata, Yuji Awano

Research output: Contribution to journal › Article › peer-review

21 Citations (Scopus)

Abstract

We examined a mechanical polishing technique for multiwalled carbon nanotube (MWNT) vias. This polishing technique involved the use of diamond particles fixing MWNT protrusions of the samples. The 1-μm-high outthrust MWNTs were polished, and then flat sample surfaces were obtained by controlling polishing pressure and polishing time. A cross-sectional image of a cut MWNT was obtained by high-resolution scanning electron microscopy. Mechanically polished MWNT interconnects with a high current density and a low resistance were developed.

Original language	English
Pages (from-to)	6499-6502
Number of pages	4
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	43
Issue number	9 A
DOIs	https://doi.org/10.1143/JJAP.43.6499
Publication status	Published - 2004 Sept
Externally published	Yes

Keywords

Diamond particles
Future ultralarge scale integrated (ULSI) circuits
Interconnects
Mechanical polishing technique
Multiwalled carbon nanotube (MWNT)

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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10.1143/JJAP.43.6499

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@article{09444437664e4449ac83a03cf36026ae,

title = "Mechanical polishing technique for carbon nanotube interconnects in ULSIs",

abstract = "We examined a mechanical polishing technique for multiwalled carbon nanotube (MWNT) vias. This polishing technique involved the use of diamond particles fixing MWNT protrusions of the samples. The 1-μm-high outthrust MWNTs were polished, and then flat sample surfaces were obtained by controlling polishing pressure and polishing time. A cross-sectional image of a cut MWNT was obtained by high-resolution scanning electron microscopy. Mechanically polished MWNT interconnects with a high current density and a low resistance were developed.",

keywords = "Diamond particles, Future ultralarge scale integrated (ULSI) circuits, Interconnects, Mechanical polishing technique, Multiwalled carbon nanotube (MWNT)",

author = "Masahiro Horibe and Mizuhisa Nihei and Daiyu Kondo and Akio Kawabata and Yuji Awano",

year = "2004",

month = sep,

doi = "10.1143/JJAP.43.6499",

language = "English",

volume = "43",

pages = "6499--6502",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

number = "9 A",

}

TY - JOUR

T1 - Mechanical polishing technique for carbon nanotube interconnects in ULSIs

AU - Horibe, Masahiro

AU - Nihei, Mizuhisa

AU - Kondo, Daiyu

AU - Kawabata, Akio

AU - Awano, Yuji

PY - 2004/9

Y1 - 2004/9

N2 - We examined a mechanical polishing technique for multiwalled carbon nanotube (MWNT) vias. This polishing technique involved the use of diamond particles fixing MWNT protrusions of the samples. The 1-μm-high outthrust MWNTs were polished, and then flat sample surfaces were obtained by controlling polishing pressure and polishing time. A cross-sectional image of a cut MWNT was obtained by high-resolution scanning electron microscopy. Mechanically polished MWNT interconnects with a high current density and a low resistance were developed.

AB - We examined a mechanical polishing technique for multiwalled carbon nanotube (MWNT) vias. This polishing technique involved the use of diamond particles fixing MWNT protrusions of the samples. The 1-μm-high outthrust MWNTs were polished, and then flat sample surfaces were obtained by controlling polishing pressure and polishing time. A cross-sectional image of a cut MWNT was obtained by high-resolution scanning electron microscopy. Mechanically polished MWNT interconnects with a high current density and a low resistance were developed.

KW - Diamond particles

KW - Future ultralarge scale integrated (ULSI) circuits

KW - Interconnects

KW - Mechanical polishing technique

KW - Multiwalled carbon nanotube (MWNT)

UR - http://www.scopus.com/inward/record.url?scp=9144222878&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=9144222878&partnerID=8YFLogxK

U2 - 10.1143/JJAP.43.6499

DO - 10.1143/JJAP.43.6499

M3 - Article

AN - SCOPUS:9144222878

SN - 0021-4922

VL - 43

SP - 6499

EP - 6502

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

IS - 9 A

ER -

Mechanical polishing technique for carbon nanotube interconnects in ULSIs

Abstract

Keywords

ASJC Scopus subject areas

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