Mechanically Magnified Sensitivity Enhancement with Micro-Step Substrate for Eye-Recognizable Structural-Color Hydrogel Biochemical Sensors

Shota Yamawaki, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a versatile device structure that can mechanically magnify the sensitivity of stimuli-responsive structural-color hydrogel biochemical sensors. In our system, the structural-color hydrogel part and the stimuli-response hydrogel part are separately arrayed on a substrate with micro-step structures, causing the height difference between the two hydrogel parts. This height difference magnifies the shrinkage ratio to be larger in the color part than in the stimulus-responsive part, achieving the x5 - x10 high sensitivity of the hydrogel-based biochemical sensor. We applied ethanol-responsive and temperature-responsive hydrogels to our proposed device and confirmed the magnification of the sensitivity compared to previous sensors. We believe that our sensor device will be an effective approach to providing sensing with practical sensitivity for medical and other applications.

Original languageEnglish
Title of host publication35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PublisherIEEE Computer Society
Pages739-742
Number of pages4
ISBN (Electronic)9781665409117
DOIs
Publication statusPublished - 2022
Event35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 - Tokyo, Japan
Duration: 2022 Jan 92022 Jan 13

Publication series

NameIEEE Symposium on Mass Storage Systems and Technologies
Volume2022-January
ISSN (Print)2160-1968

Conference

Conference35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Country/TerritoryJapan
CityTokyo
Period22/1/922/1/13

Keywords

  • Biochemical sensors
  • Hydrogel
  • Stimuli responsive material
  • Structural color

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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