MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles

S. Kohyama, Hidetoshi Takahashi, S. Yoshida, Hiroaki Onoe, K. H. Shoji, T. Tsukagoshi, T. Takahata, I. Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper reports on a method to measure spring constant of hydrogel microparticles by a MEMS sensor. For calculating spring constant, not only force but also displacement is necessary. The MEMS sensor consists of two sidewall doped piezoresistive cantilevers in the ranges of μΝ and μm so that both parameters can be measured simultaneously. When one cantilever pushes a target to a wall, the cantilever can measure the restoring force of the target. At the same time, the other cantilever measures the displacement by pushing the wall directly. By measuring both force and displacement on the same sensor chip, the spring constant of targets can be obtained only from the sensor outputs, which makes the sensor system simple and compact. With this advantage, our method can be useful in actual experiments with microscopes and other systems.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1040-1043
Number of pages4
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - 2017 Feb 23
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 2017 Jan 222017 Jan 26

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period17/1/2217/1/26

Fingerprint

Hydrogel
microparticles
Hydrogels
microelectromechanical systems
MEMS
sensors
Sensors
pushing
Microscopes
chips
microscopes
output
Experiments

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Kohyama, S., Takahashi, H., Yoshida, S., Onoe, H., Shoji, K. H., Tsukagoshi, T., ... Shimoyama, I. (2017). MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 1040-1043). [7863590] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863590

MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles. / Kohyama, S.; Takahashi, Hidetoshi; Yoshida, S.; Onoe, Hiroaki; Shoji, K. H.; Tsukagoshi, T.; Takahata, T.; Shimoyama, I.

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1040-1043 7863590.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kohyama, S, Takahashi, H, Yoshida, S, Onoe, H, Shoji, KH, Tsukagoshi, T, Takahata, T & Shimoyama, I 2017, MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles. in 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017., 7863590, Institute of Electrical and Electronics Engineers Inc., pp. 1040-1043, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, Las Vegas, United States, 17/1/22. https://doi.org/10.1109/MEMSYS.2017.7863590
Kohyama S, Takahashi H, Yoshida S, Onoe H, Shoji KH, Tsukagoshi T et al. MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1040-1043. 7863590 https://doi.org/10.1109/MEMSYS.2017.7863590
Kohyama, S. ; Takahashi, Hidetoshi ; Yoshida, S. ; Onoe, Hiroaki ; Shoji, K. H. ; Tsukagoshi, T. ; Takahata, T. ; Shimoyama, I. / MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles. 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1040-1043
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