TY - GEN
T1 - MEMS force and displacement sensor for measuring spring constant of hydrogel microparticles
AU - Kohyama, S.
AU - Takahashi, H.
AU - Yoshida, S.
AU - Onoe, H.
AU - Shoji, K. H.
AU - Tsukagoshi, T.
AU - Takahata, T.
AU - Shimoyama, I.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - This paper reports on a method to measure spring constant of hydrogel microparticles by a MEMS sensor. For calculating spring constant, not only force but also displacement is necessary. The MEMS sensor consists of two sidewall doped piezoresistive cantilevers in the ranges of μΝ and μm so that both parameters can be measured simultaneously. When one cantilever pushes a target to a wall, the cantilever can measure the restoring force of the target. At the same time, the other cantilever measures the displacement by pushing the wall directly. By measuring both force and displacement on the same sensor chip, the spring constant of targets can be obtained only from the sensor outputs, which makes the sensor system simple and compact. With this advantage, our method can be useful in actual experiments with microscopes and other systems.
AB - This paper reports on a method to measure spring constant of hydrogel microparticles by a MEMS sensor. For calculating spring constant, not only force but also displacement is necessary. The MEMS sensor consists of two sidewall doped piezoresistive cantilevers in the ranges of μΝ and μm so that both parameters can be measured simultaneously. When one cantilever pushes a target to a wall, the cantilever can measure the restoring force of the target. At the same time, the other cantilever measures the displacement by pushing the wall directly. By measuring both force and displacement on the same sensor chip, the spring constant of targets can be obtained only from the sensor outputs, which makes the sensor system simple and compact. With this advantage, our method can be useful in actual experiments with microscopes and other systems.
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U2 - 10.1109/MEMSYS.2017.7863590
DO - 10.1109/MEMSYS.2017.7863590
M3 - Conference contribution
AN - SCOPUS:85015772831
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1040
EP - 1043
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -