Message from the Organizing Committee Chair

Research output: Contribution to journalEditorial

Original languageEnglish
Article number8721341
Pages (from-to)I-II
JournalIEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
DOIs
Publication statusPublished - 2019 May 23
Event22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Yokohama, Japan
Duration: 2019 Apr 172019 Apr 19

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

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title = "Message from the Organizing Committee Chair",
author = "Hideharu Amano",
year = "2019",
month = "5",
day = "23",
doi = "10.1109/CoolChips.2019.8721341",
language = "English",
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journal = "IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings",

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