Micro-hardness, microstructures and thermal stability of (Ti,Cr,Al,Si)N films deposited by cathodic arc method

H. Ezura, K. Ichijo, H. Hasegawa, K. Yamamoto, A. Hotta, T. Suzuki

Research output: Contribution to journalArticle

26 Citations (Scopus)


(Ti,Cr,Al,Si)N films were deposited by cathodic arc method using TiCrAlSi alloy cathodes. It was found that the microstructures of (Ti,Cr,Al,Si)N were closely related to (Al+Si) content. The crystal structure of (Ti,Cr,Al,Si)N was NaCl-type structure up to the (Al+Si) content of 0.60, where it changed to a hexagonal structure. The maximum hardness of 33 GPa was obtained at the lowest (Al+Si) content of 0.56, still in the cubic structure. The micro-hardness decreased down to 28 GPa as the crystal structure changed from NaCl-type to wurtzite-type. To investigate the thermal stabilities of (Ti,Cr,Al,Si)N, the films were annealed in a vacuum furnace. In Ti0.20Cr0.20Al0.55Si0.05N with cubic structure, the phase segregation occurred by annealing at over 900 °C, while Ti0.22Cr0.22Al0.44Si0.12N remained in cubic phase up to 1000 °C. The micro-hardness of Ti0.20Cr0.20Al0.55Si0.05N increased and that of Ti0.22Cr0.22Al0.44Si0.12N decreased at 1000 °C. Ti0.20Cr0.11Al0.58Si0.11N with a cubic and hexagonal mixture phase held its (c,h)-mixture phase up to 1000 °C, while there was an indication of an increase both in micro-hardness and in cubic ratio after annealing. In this paper, the micro-hardness and microstructure of (Ti,Cr,Al,Si)N are discussed as a function of annealing temperature and investigated by X-ray diffraction and electron microscopy.

Original languageEnglish
Pages (from-to)476-481
Number of pages6
Issue number5
Publication statusPublished - 2008 Jan 8


  • (Ti,Cr,Al,Si)N
  • Cutting tools
  • PVD
  • Thermal stability
  • Thin films

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

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