Micro-hardness, microstructures and thermal stability of (Ti,Cr,Al,Si)N films deposited by cathodic arc method

H. Ezura, K. Ichijo, H. Hasegawa, K. Yamamoto, A. Hotta, T. Suzuki

Research output: Contribution to journalArticlepeer-review

27 Citations (Scopus)

Abstract

(Ti,Cr,Al,Si)N films were deposited by cathodic arc method using TiCrAlSi alloy cathodes. It was found that the microstructures of (Ti,Cr,Al,Si)N were closely related to (Al+Si) content. The crystal structure of (Ti,Cr,Al,Si)N was NaCl-type structure up to the (Al+Si) content of 0.60, where it changed to a hexagonal structure. The maximum hardness of 33 GPa was obtained at the lowest (Al+Si) content of 0.56, still in the cubic structure. The micro-hardness decreased down to 28 GPa as the crystal structure changed from NaCl-type to wurtzite-type. To investigate the thermal stabilities of (Ti,Cr,Al,Si)N, the films were annealed in a vacuum furnace. In Ti0.20Cr0.20Al0.55Si0.05N with cubic structure, the phase segregation occurred by annealing at over 900 °C, while Ti0.22Cr0.22Al0.44Si0.12N remained in cubic phase up to 1000 °C. The micro-hardness of Ti0.20Cr0.20Al0.55Si0.05N increased and that of Ti0.22Cr0.22Al0.44Si0.12N decreased at 1000 °C. Ti0.20Cr0.11Al0.58Si0.11N with a cubic and hexagonal mixture phase held its (c,h)-mixture phase up to 1000 °C, while there was an indication of an increase both in micro-hardness and in cubic ratio after annealing. In this paper, the micro-hardness and microstructure of (Ti,Cr,Al,Si)N are discussed as a function of annealing temperature and investigated by X-ray diffraction and electron microscopy.

Original languageEnglish
Pages (from-to)476-481
Number of pages6
JournalVacuum
Volume82
Issue number5
DOIs
Publication statusPublished - 2008 Jan 8

Keywords

  • (Ti,Cr,Al,Si)N
  • Cutting tools
  • PVD
  • Thermal stability
  • Thin films

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

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