Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya; Hisashi Sato; Masahiro Nishida; Chuantong Chen; Nobuyuki Shishido; Masaki Omiya; Takashi Suzuki; Tomoji Nakamura; Takeshi Nokuo; Tadahiro Nagasawa

doi:10.1063/1.3527134

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Nobuyuki Shishido, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

Original language	English
Title of host publication	Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization
Pages	33-38
Number of pages	6
DOIs	https://doi.org/10.1063/1.3527134
Publication status	Published - 2010
Event	11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany Duration: 2010 Apr 12 → 2010 Apr 14

Publication series

Name	AIP Conference Proceedings
Volume	1300
ISSN (Print)	0094-243X
ISSN (Electronic)	1551-7616

Other

Other	11th International Workshop on Stress-Induced Phenomena in Metallization
Country/Territory	Germany
City	Bad Schandau
Period	10/4/12 → 10/4/14

Keywords

Cu line
Toughness of interface
damascene process
fracture

ASJC Scopus subject areas

Physics and Astronomy(all)

Access to Document

10.1063/1.3527134

Cite this

Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T., & Nagasawa, T. (2010). Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. In Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization (pp. 33-38). (AIP Conference Proceedings; Vol. 1300). https://doi.org/10.1063/1.3527134

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. / Kamiya, Shoji; Sato, Hisashi; Nishida, Masahiro et al.
Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. 2010. p. 33-38 (AIP Conference Proceedings; Vol. 1300).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kamiya, S, Sato, H, Nishida, M, Chen, C, Shishido, N, Omiya, M, Suzuki, T, Nakamura, T, Nokuo, T & Nagasawa, T 2010, Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. in Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. AIP Conference Proceedings, vol. 1300, pp. 33-38, 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 10/4/12. https://doi.org/10.1063/1.3527134

@inproceedings{43c1359d7eb74c6d8756d1e032669887,

title = "Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects",

abstract = "Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.",

keywords = "Cu line, Toughness of interface, damascene process, fracture",

author = "Shoji Kamiya and Hisashi Sato and Masahiro Nishida and Chuantong Chen and Nobuyuki Shishido and Masaki Omiya and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Tadahiro Nagasawa",

year = "2010",

doi = "10.1063/1.3527134",

language = "English",

isbn = "9780735408555",

series = "AIP Conference Proceedings",

pages = "33--38",

booktitle = "Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization",

note = "11th International Workshop on Stress-Induced Phenomena in Metallization ; Conference date: 12-04-2010 Through 14-04-2010",

}

TY - GEN

T1 - Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

AU - Kamiya, Shoji

AU - Sato, Hisashi

AU - Nishida, Masahiro

AU - Chen, Chuantong

AU - Shishido, Nobuyuki

AU - Omiya, Masaki

AU - Suzuki, Takashi

AU - Nakamura, Tomoji

AU - Nokuo, Takeshi

AU - Nagasawa, Tadahiro

PY - 2010

Y1 - 2010

N2 - Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

AB - Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

KW - Cu line

KW - Toughness of interface

KW - damascene process

KW - fracture

UR - http://www.scopus.com/inward/record.url?scp=79251551955&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79251551955&partnerID=8YFLogxK

U2 - 10.1063/1.3527134

DO - 10.1063/1.3527134

M3 - Conference contribution

AN - SCOPUS:79251551955

SN - 9780735408555

T3 - AIP Conference Proceedings

SP - 33

EP - 38

BT - Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization

T2 - 11th International Workshop on Stress-Induced Phenomena in Metallization

Y2 - 12 April 2010 through 14 April 2010

ER -

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Abstract

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Keywords

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