Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Nobuyuki Shishido, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

Original languageEnglish
Title of host publicationAIP Conference Proceedings
Pages33-38
Number of pages6
Volume1300
DOIs
Publication statusPublished - 2010
Event11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
Duration: 2010 Apr 122010 Apr 14

Other

Other11th International Workshop on Stress-Induced Phenomena in Metallization
CountryGermany
CityBad Schandau
Period10/4/1210/4/14

Fingerprint

large scale integration
evaluation
adhesion
caps
electronics
energy

Keywords

  • Cu line
  • damascene process
  • fracture
  • Toughness of interface

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., ... Nagasawa, T. (2010). Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. In AIP Conference Proceedings (Vol. 1300, pp. 33-38) https://doi.org/10.1063/1.3527134

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. / Kamiya, Shoji; Sato, Hisashi; Nishida, Masahiro; Chen, Chuantong; Shishido, Nobuyuki; Omiya, Masaki; Suzuki, Takashi; Nakamura, Tomoji; Nokuo, Takeshi; Nagasawa, Tadahiro.

AIP Conference Proceedings. Vol. 1300 2010. p. 33-38.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kamiya, S, Sato, H, Nishida, M, Chen, C, Shishido, N, Omiya, M, Suzuki, T, Nakamura, T, Nokuo, T & Nagasawa, T 2010, Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. in AIP Conference Proceedings. vol. 1300, pp. 33-38, 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 10/4/12. https://doi.org/10.1063/1.3527134
Kamiya S, Sato H, Nishida M, Chen C, Shishido N, Omiya M et al. Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. In AIP Conference Proceedings. Vol. 1300. 2010. p. 33-38 https://doi.org/10.1063/1.3527134
Kamiya, Shoji ; Sato, Hisashi ; Nishida, Masahiro ; Chen, Chuantong ; Shishido, Nobuyuki ; Omiya, Masaki ; Suzuki, Takashi ; Nakamura, Tomoji ; Nokuo, Takeshi ; Nagasawa, Tadahiro. / Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. AIP Conference Proceedings. Vol. 1300 2010. pp. 33-38
@inproceedings{43c1359d7eb74c6d8756d1e032669887,
title = "Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects",
abstract = "Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.",
keywords = "Cu line, damascene process, fracture, Toughness of interface",
author = "Shoji Kamiya and Hisashi Sato and Masahiro Nishida and Chuantong Chen and Nobuyuki Shishido and Masaki Omiya and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Tadahiro Nagasawa",
year = "2010",
doi = "10.1063/1.3527134",
language = "English",
isbn = "9780735408555",
volume = "1300",
pages = "33--38",
booktitle = "AIP Conference Proceedings",

}

TY - GEN

T1 - Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

AU - Kamiya, Shoji

AU - Sato, Hisashi

AU - Nishida, Masahiro

AU - Chen, Chuantong

AU - Shishido, Nobuyuki

AU - Omiya, Masaki

AU - Suzuki, Takashi

AU - Nakamura, Tomoji

AU - Nokuo, Takeshi

AU - Nagasawa, Tadahiro

PY - 2010

Y1 - 2010

N2 - Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

AB - Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

KW - Cu line

KW - damascene process

KW - fracture

KW - Toughness of interface

UR - http://www.scopus.com/inward/record.url?scp=79251551955&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79251551955&partnerID=8YFLogxK

U2 - 10.1063/1.3527134

DO - 10.1063/1.3527134

M3 - Conference contribution

SN - 9780735408555

VL - 1300

SP - 33

EP - 38

BT - AIP Conference Proceedings

ER -