Micro suction cup array for wet/dry adhesion

N. Thanh-Vinh, Hidetoshi Takahashi, T. Kan, K. Noda, K. Matsumoto, I. Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages284-287
Number of pages4
DOIs
Publication statusPublished - 2011 Apr 13
Externally publishedYes
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 2011 Jan 232011 Jan 27

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period11/1/2311/1/27

Fingerprint

suction
adhesion
Adhesion
Glass
glass
Microstructure
microstructure

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Thanh-Vinh, N., Takahashi, H., Kan, T., Noda, K., Matsumoto, K., & Shimoyama, I. (2011). Micro suction cup array for wet/dry adhesion. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 284-287). [5734417] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734417

Micro suction cup array for wet/dry adhesion. / Thanh-Vinh, N.; Takahashi, Hidetoshi; Kan, T.; Noda, K.; Matsumoto, K.; Shimoyama, I.

2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 284-287 5734417 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thanh-Vinh, N, Takahashi, H, Kan, T, Noda, K, Matsumoto, K & Shimoyama, I 2011, Micro suction cup array for wet/dry adhesion. in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011., 5734417, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 284-287, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 11/1/23. https://doi.org/10.1109/MEMSYS.2011.5734417
Thanh-Vinh N, Takahashi H, Kan T, Noda K, Matsumoto K, Shimoyama I. Micro suction cup array for wet/dry adhesion. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 284-287. 5734417. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734417
Thanh-Vinh, N. ; Takahashi, Hidetoshi ; Kan, T. ; Noda, K. ; Matsumoto, K. ; Shimoyama, I. / Micro suction cup array for wet/dry adhesion. 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. pp. 284-287 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).
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