Microstructures of (Ti,Cr,Al,Si)N films synthesized by cathodic arc method

K. Ichijo, H. Hasegawa, T. Suzuki

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

(Ti,Cr,Al,Si)N films were deposited on WC and Si substrate by cathodic arc method with TiCrAlSi alloy cathodes. At lower (Al + Si) contents from 0.56 to 0.60, the crystal structure of (Ti,Cr,Al,Si)N had NaCl type cubic structure. With increasing (Al + Si) contents, the NaCl structure changed to a hexagonal structure. The maximum hardness of (Ti,Cr,Al,Si)N was 31 GPa at 0.56 of (Si + Al) contents. Corresponding with structural changes from NaCl to wurtzite, microhardness decreased down to 26 GPa. TEM photographs indicated that embedding Si atom was effective to decreased grain sizes of 5-10 nm. In this paper, relationships between microstructure and microhardness as a function of Si and Al contents are discussed based on the phase transformation, analyzed by X-ray diffraction method and transmission electron microscopy.

Original languageEnglish
Pages (from-to)5477-5480
Number of pages4
JournalSurface and Coatings Technology
Volume201
Issue number9-11 SPEC. ISS.
DOIs
Publication statusPublished - 2007 Feb 26

Keywords

  • (Ti,Cr,Al,Si)N
  • Microhardness
  • Microstructure

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Microstructures of (Ti,Cr,Al,Si)N films synthesized by cathodic arc method'. Together they form a unique fingerprint.

  • Cite this