Miniature stiffness tunable device with magnetorheological fluid

H. Ishizuka, T. Nakadegawa, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study demonstrates new liquid encapsulation method based on adhesive force between liquid and solid. Various liquid encapsulation methods have been proposed. However, these method have limitations. For example, the structure that encapsulates liquid in palyrene membrane are too fragile and not suitable for actuators. Bonding methods can applicable to only two dimensional structures. We developed a liquid encapsulation method with only two process in miniature structure. We utilized magnetorheological (MR) fluid that reacted to an external magnetic field as encapsulated liquid. We investigated the relation between the size and various fabrication factors. We also investigated the relation between the applied magnetic field and the resulting resistive force for application. The results indicated that resistive force increased from 6.2 mN to 9 mN by applying the magnetic field of 400 mT. The structure can be applicable to tactile display that present spatial distribution of stiffness.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages409-412
Number of pages4
ISBN (Print)9784904090138
DOIs
Publication statusPublished - 2015 May 20
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 2015 Apr 142015 Apr 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
CountryJapan
CityKyoto
Period15/4/1415/4/17

Fingerprint

Magnetorheological fluids
Stiffness
Liquids
Encapsulation
Magnetic fields
Spatial distribution
Adhesives
Actuators
Display devices
Membranes
Fabrication

Keywords

  • Liquid encapsulation method
  • MEMS
  • MR fluid
  • Smart fluid
  • Tactile display

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ishizuka, H., Nakadegawa, T., & Miki, N. (2015). Miniature stiffness tunable device with magnetorheological fluid. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 409-412). [7111046] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111046

Miniature stiffness tunable device with magnetorheological fluid. / Ishizuka, H.; Nakadegawa, T.; Miki, Norihisa.

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. p. 409-412 7111046.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ishizuka, H, Nakadegawa, T & Miki, N 2015, Miniature stiffness tunable device with magnetorheological fluid. in ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference., 7111046, Institute of Electrical and Electronics Engineers Inc., pp. 409-412, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015, Kyoto, Japan, 15/4/14. https://doi.org/10.1109/ICEP-IAAC.2015.7111046
Ishizuka H, Nakadegawa T, Miki N. Miniature stiffness tunable device with magnetorheological fluid. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc. 2015. p. 409-412. 7111046 https://doi.org/10.1109/ICEP-IAAC.2015.7111046
Ishizuka, H. ; Nakadegawa, T. ; Miki, Norihisa. / Miniature stiffness tunable device with magnetorheological fluid. ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 409-412
@inproceedings{73cbfb28b7a94fb1b3f02fa2ab685f4f,
title = "Miniature stiffness tunable device with magnetorheological fluid",
abstract = "This study demonstrates new liquid encapsulation method based on adhesive force between liquid and solid. Various liquid encapsulation methods have been proposed. However, these method have limitations. For example, the structure that encapsulates liquid in palyrene membrane are too fragile and not suitable for actuators. Bonding methods can applicable to only two dimensional structures. We developed a liquid encapsulation method with only two process in miniature structure. We utilized magnetorheological (MR) fluid that reacted to an external magnetic field as encapsulated liquid. We investigated the relation between the size and various fabrication factors. We also investigated the relation between the applied magnetic field and the resulting resistive force for application. The results indicated that resistive force increased from 6.2 mN to 9 mN by applying the magnetic field of 400 mT. The structure can be applicable to tactile display that present spatial distribution of stiffness.",
keywords = "Liquid encapsulation method, MEMS, MR fluid, Smart fluid, Tactile display",
author = "H. Ishizuka and T. Nakadegawa and Norihisa Miki",
year = "2015",
month = "5",
day = "20",
doi = "10.1109/ICEP-IAAC.2015.7111046",
language = "English",
isbn = "9784904090138",
pages = "409--412",
booktitle = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Miniature stiffness tunable device with magnetorheological fluid

AU - Ishizuka, H.

AU - Nakadegawa, T.

AU - Miki, Norihisa

PY - 2015/5/20

Y1 - 2015/5/20

N2 - This study demonstrates new liquid encapsulation method based on adhesive force between liquid and solid. Various liquid encapsulation methods have been proposed. However, these method have limitations. For example, the structure that encapsulates liquid in palyrene membrane are too fragile and not suitable for actuators. Bonding methods can applicable to only two dimensional structures. We developed a liquid encapsulation method with only two process in miniature structure. We utilized magnetorheological (MR) fluid that reacted to an external magnetic field as encapsulated liquid. We investigated the relation between the size and various fabrication factors. We also investigated the relation between the applied magnetic field and the resulting resistive force for application. The results indicated that resistive force increased from 6.2 mN to 9 mN by applying the magnetic field of 400 mT. The structure can be applicable to tactile display that present spatial distribution of stiffness.

AB - This study demonstrates new liquid encapsulation method based on adhesive force between liquid and solid. Various liquid encapsulation methods have been proposed. However, these method have limitations. For example, the structure that encapsulates liquid in palyrene membrane are too fragile and not suitable for actuators. Bonding methods can applicable to only two dimensional structures. We developed a liquid encapsulation method with only two process in miniature structure. We utilized magnetorheological (MR) fluid that reacted to an external magnetic field as encapsulated liquid. We investigated the relation between the size and various fabrication factors. We also investigated the relation between the applied magnetic field and the resulting resistive force for application. The results indicated that resistive force increased from 6.2 mN to 9 mN by applying the magnetic field of 400 mT. The structure can be applicable to tactile display that present spatial distribution of stiffness.

KW - Liquid encapsulation method

KW - MEMS

KW - MR fluid

KW - Smart fluid

KW - Tactile display

UR - http://www.scopus.com/inward/record.url?scp=84936087199&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84936087199&partnerID=8YFLogxK

U2 - 10.1109/ICEP-IAAC.2015.7111046

DO - 10.1109/ICEP-IAAC.2015.7111046

M3 - Conference contribution

AN - SCOPUS:84936087199

SN - 9784904090138

SP - 409

EP - 412

BT - ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

PB - Institute of Electrical and Electronics Engineers Inc.

ER -