Modeling of dc magnetron plasma for sputtering: Transport of sputtered copper atoms

T. Yagisawa, T. Makabe

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

A self-consistent modeling of two-dimensional structures of a dc magnetron plasma with a copper target is performed at 5 mTorr in Ar by using a hybrid model consisting of a particle-in-cell/Monte Carlo simulation for electrons and relaxation continuum model for ions. The erosion profile of the copper target is estimated by the flux velocity distribution of ions incident on the target. In the case of a dc magnetron, the discharge is mainly sustained by an E×B drift motion of energetic electrons near the position Bz ∼0 with a static doughnutlike magnetic field. Then, a strongly localized profile appears in the plasma structures. The position of a maximum erosion on the copper target exactly coincides with the position where the incident Ar+ ion flux is maximum. Under the system between the light ion and the heavy target atom, the energy of the sputtered Cu atom is low (<10 eV) despite the high-energy ion injection (∼200 eV) to the target surface. In particular, we have developed a technique to predict the transport of sputtered particles in the gas phase within a reasonable computational time. The spatial distribution of the sputtered particles is divided into two components: "directional" fast-moving particles that do not collide with Ar feed gas in the gas phase and "random" slow-moving particles whose energy is relaxed by collision. The sputtered Cu atoms are widely dispersed from the doughnutlike region on the target. At 5 mTorr, the flux of sputtered Cu atoms at the substrate is mainly affected by the random particles with relaxed energy by collision.

Original languageEnglish
Article number076604JVA
Pages (from-to)908-913
Number of pages6
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume24
Issue number4
DOIs
Publication statusPublished - 2006 Jul

Fingerprint

Sputtering
Copper
sputtering
Ions
Plasmas
copper
Atoms
Gases
Fluxes
atoms
Erosion
Heavy Ions
Electrons
erosion
Velocity distribution
Spatial distribution
ion injection
vapor phases
ions
Magnetic fields

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Surfaces and Interfaces
  • Physics and Astronomy (miscellaneous)

Cite this

Modeling of dc magnetron plasma for sputtering : Transport of sputtered copper atoms. / Yagisawa, T.; Makabe, T.

In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 24, No. 4, 076604JVA, 07.2006, p. 908-913.

Research output: Contribution to journalArticle

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