Modeling of feature profile evolution in SiO2 as functions of radial position and bias voltage under competition among charging, deposition, and etching in two-frequency capacitively coupled plasma

Takashi Shimada, Takashi Yagisawa, Toshiaki Makabe

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

A feature profile evolution model of a trench in SiO2 is developed in a two-frequency capacitively coupled plasma in CF 4(5%)/Ar by considering two layers, a mixing layer and an overlaying polymer layer on the basis of a database of etching yield by extending our original physical computer-aided design (CAD) tool, VicAddress (vertically integrated computer-aided design for device processes). That is, the surface exposed to fluorocarbon plasma is considered under competition among the charging of electrons and ions, the deposition of radicals, and reactive etching by ions. The feature profile is also discussed in terms or the bias amplitude and the position on the wafer.

Original languageEnglish
Pages (from-to)8876-8882
Number of pages7
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume45
Issue number11
DOIs
Publication statusPublished - 2006 Nov 15

Fingerprint

computer aided design
Bias voltage
charging
Etching
Computer aided design
etching
Plasmas
Fluorocarbons
fluorocarbons
Ions
electric potential
profiles
ions
wafers
Electrons
polymers
Polymers
electrons

Keywords

  • Charging
  • Competitive process
  • Feature profile evolution
  • Radial uniformity
  • SiO etching

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

@article{1e07d964b0054639b3430066e37110d1,
title = "Modeling of feature profile evolution in SiO2 as functions of radial position and bias voltage under competition among charging, deposition, and etching in two-frequency capacitively coupled plasma",
abstract = "A feature profile evolution model of a trench in SiO2 is developed in a two-frequency capacitively coupled plasma in CF 4(5{\%})/Ar by considering two layers, a mixing layer and an overlaying polymer layer on the basis of a database of etching yield by extending our original physical computer-aided design (CAD) tool, VicAddress (vertically integrated computer-aided design for device processes). That is, the surface exposed to fluorocarbon plasma is considered under competition among the charging of electrons and ions, the deposition of radicals, and reactive etching by ions. The feature profile is also discussed in terms or the bias amplitude and the position on the wafer.",
keywords = "Charging, Competitive process, Feature profile evolution, Radial uniformity, SiO etching",
author = "Takashi Shimada and Takashi Yagisawa and Toshiaki Makabe",
year = "2006",
month = "11",
day = "15",
doi = "10.1143/JJAP.45.8876",
language = "English",
volume = "45",
pages = "8876--8882",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "11",

}

TY - JOUR

T1 - Modeling of feature profile evolution in SiO2 as functions of radial position and bias voltage under competition among charging, deposition, and etching in two-frequency capacitively coupled plasma

AU - Shimada, Takashi

AU - Yagisawa, Takashi

AU - Makabe, Toshiaki

PY - 2006/11/15

Y1 - 2006/11/15

N2 - A feature profile evolution model of a trench in SiO2 is developed in a two-frequency capacitively coupled plasma in CF 4(5%)/Ar by considering two layers, a mixing layer and an overlaying polymer layer on the basis of a database of etching yield by extending our original physical computer-aided design (CAD) tool, VicAddress (vertically integrated computer-aided design for device processes). That is, the surface exposed to fluorocarbon plasma is considered under competition among the charging of electrons and ions, the deposition of radicals, and reactive etching by ions. The feature profile is also discussed in terms or the bias amplitude and the position on the wafer.

AB - A feature profile evolution model of a trench in SiO2 is developed in a two-frequency capacitively coupled plasma in CF 4(5%)/Ar by considering two layers, a mixing layer and an overlaying polymer layer on the basis of a database of etching yield by extending our original physical computer-aided design (CAD) tool, VicAddress (vertically integrated computer-aided design for device processes). That is, the surface exposed to fluorocarbon plasma is considered under competition among the charging of electrons and ions, the deposition of radicals, and reactive etching by ions. The feature profile is also discussed in terms or the bias amplitude and the position on the wafer.

KW - Charging

KW - Competitive process

KW - Feature profile evolution

KW - Radial uniformity

KW - SiO etching

UR - http://www.scopus.com/inward/record.url?scp=34547888047&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34547888047&partnerID=8YFLogxK

U2 - 10.1143/JJAP.45.8876

DO - 10.1143/JJAP.45.8876

M3 - Article

AN - SCOPUS:34547888047

VL - 45

SP - 8876

EP - 8882

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 11

ER -