Monitoring Volcanic Activity with High Sensitive Infrasound Sensor Using a Piezoresistive Cantilever

Jumpei Shimatani, Hidetoshi Takahashi, Mie Ichihara, Tomoyuki Takahata, Isao Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we propose a high sensitive monitoring method of infrasound evoked by a volcano eruption. The sensor unit is composed of two differential pressure sensors and an air chamber. The pressure resolution of the developed sensor is approximately 0.01 Pa, which is sufficiently small to detect the tiny infrasound. The measurable frequency range is from 0.3 Hz, which is sufficiently low for the infrasound. The sensor units were set at the foot of volcano, Sakurajima, Kagoshima, Japan. It was confirmed that the sensors kept the high sensitive monitoring performance for a month.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages783-786
Number of pages4
ISBN (Electronic)9781728116105
DOIs
Publication statusPublished - 2019 Jan
Externally publishedYes
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 2019 Jan 272019 Jan 31

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
CountryKorea, Republic of
CitySeoul
Period19/1/2719/1/31

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Shimatani, J., Takahashi, H., Ichihara, M., Takahata, T., & Shimoyama, I. (2019). Monitoring Volcanic Activity with High Sensitive Infrasound Sensor Using a Piezoresistive Cantilever. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019 (pp. 783-786). [8870832] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2019.8870832