Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    1,000 fps motion vector estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient motion vector estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on motion vector patterns, enabling the classification of moving objects not possible in conventional proposals.

    Original languageEnglish
    Title of host publicationESSCIRC 2016: 42nd European Solid-State Circuits Conference
    PublisherIEEE Computer Society
    Pages105-108
    Number of pages4
    Volume2016-October
    ISBN (Electronic)9781509029723
    DOIs
    Publication statusPublished - 2016 Oct 18
    Event42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
    Duration: 2016 Sep 122016 Sep 15

    Other

    Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
    CountrySwitzerland
    CityLausanne
    Period16/9/1216/9/15

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Asai, T., Mori, M., Itou, T., Take, Y., Ikebe, M., Kuroda, T., & Motomura, M. (2016). Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference (Vol. 2016-October, pp. 105-108). [7598253] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598253