Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

Tetsuya Asai; Masafumi Mori; Toshiyuki Itou; Yasuhiro Take; Masayuki Ikebe; Tadahiro Kuroda; Masato Motomura

doi:10.1109/ESSCIRC.2016.7598253

Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

1,000 fps motion vector estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient motion vector estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on motion vector patterns, enabling the classification of moving objects not possible in conventional proposals.

Original language	English
Title of host publication	ESSCIRC 2016: 42nd European Solid-State Circuits Conference
Publisher	IEEE Computer Society
Pages	105-108
Number of pages	4
Volume	2016-October
ISBN (Electronic)	9781509029723
DOIs	https://doi.org/10.1109/ESSCIRC.2016.7598253
Publication status	Published - 2016 Oct 18
Event	42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland Duration: 2016 Sept 12 → 2016 Sept 15

Other

Other	42nd European Solid-State Circuits Conference, ESSCIRC 2016
Country/Territory	Switzerland
City	Lausanne
Period	16/9/12 → 16/9/15

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/ESSCIRC.2016.7598253

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Asai, T., Mori, M., Itou, T., Take, Y., Ikebe, M., Kuroda, T., & Motomura, M. (2016). Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference (Vol. 2016-October, pp. 105-108). [7598253] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598253

Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. / Asai, Tetsuya; Mori, Masafumi; Itou, Toshiyuki et al.

ESSCIRC 2016: 42nd European Solid-State Circuits Conference. Vol. 2016-October IEEE Computer Society, 2016. p. 105-108 7598253.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Asai, T, Mori, M, Itou, T, Take, Y, Ikebe, M, Kuroda, T & Motomura, M 2016, Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. in ESSCIRC 2016: 42nd European Solid-State Circuits Conference. vol. 2016-October, 7598253, IEEE Computer Society, pp. 105-108, 42nd European Solid-State Circuits Conference, ESSCIRC 2016, Lausanne, Switzerland, 16/9/12. https://doi.org/10.1109/ESSCIRC.2016.7598253

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Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

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