MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link

S. Saito, Y. Kohama, Y. Sugimori, Y. Hasegawa, Hiroki Matsutani, T. Sano, K. Kasuga, Y. Yoshida, K. Niitsu, N. Miura, Tadahiro Kuroda, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

MuCCRA-Cube is a scalable three dimensional dynamically reconfigurable processor. By stacking multiple dies connected with inductive-coupling links, the number of PE array can be increased so that the required performance is achieved. A prototype chip with 90nm CMOS process consisting of four dies each of which has a 4 x 4 PE array was implemented. The vertical link achieved 7.2Gb/s/chip, and the average execution time is reduced to 31% compared to that using a single chip.

Original languageEnglish
Title of host publicationFPL 09: 19th International Conference on Field Programmable Logic and Applications
Pages6-11
Number of pages6
DOIs
Publication statusPublished - 2009
EventFPL 09: 19th International Conference on Field Programmable Logic and Applications - Prague, Czech Republic
Duration: 2009 Aug 312009 Sep 2

Other

OtherFPL 09: 19th International Conference on Field Programmable Logic and Applications
CountryCzech Republic
CityPrague
Period09/8/3109/9/2

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Computer Science Applications

Cite this

Saito, S., Kohama, Y., Sugimori, Y., Hasegawa, Y., Matsutani, H., Sano, T., ... Amano, H. (2009). MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link. In FPL 09: 19th International Conference on Field Programmable Logic and Applications (pp. 6-11). [5272565] https://doi.org/10.1109/FPL.2009.5272565