Abstract
The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.
Original language | English |
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Title of host publication | 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781509013869 |
DOIs | |
Publication status | Published - 2016 Jul 5 |
Event | 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Yokohama, Japan Duration: 2016 Apr 20 → 2016 Apr 22 |
Other
Other | 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 |
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Country | Japan |
City | Yokohama |
Period | 16/4/20 → 16/4/22 |
ASJC Scopus subject areas
- Hardware and Architecture