MuCCRA4-BB: A fine-grained body biasing capable DRP

Johannes Maximilian Kuhn, Akram Ben Ahmed, Hayate Okuhara, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.

Original languageEnglish
Title of host publication19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509013869
DOIs
Publication statusPublished - 2016 Jul 5
Event19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Yokohama, Japan
Duration: 2016 Apr 202016 Apr 22

Publication series

Name19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings

Other

Other19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016
Country/TerritoryJapan
CityYokohama
Period16/4/2016/4/22

ASJC Scopus subject areas

  • Hardware and Architecture

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