MuCCRA4-BB: A fine-grained body biasing capable DRP

Johannes Maximilian Kuhn; Akram Ben Ahmed; Hayate Okuhara; Hideharu Amano; Oliver Bringmann; Wolfgang Rosenstiel

doi:10.1109/CoolChips.2016.7503676

MuCCRA4-BB: A fine-grained body biasing capable DRP

Johannes Maximilian Kuhn, Akram Ben Ahmed, Hayate Okuhara, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel

Department of Information and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.

Original language	English
Title of host publication	19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781509013869
DOIs	https://doi.org/10.1109/CoolChips.2016.7503676
Publication status	Published - 2016 Jul 5
Event	19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Yokohama, Japan Duration: 2016 Apr 20 → 2016 Apr 22

Other

Other	19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016
Country	Japan
City	Yokohama
Period	16/4/20 → 16/4/22

ASJC Scopus subject areas

Hardware and Architecture

Access to Document

10.1109/CoolChips.2016.7503676

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Kuhn, J. M., Ben Ahmed, A., Okuhara, H., Amano, H., Bringmann, O., & Rosenstiel, W. (2016). MuCCRA4-BB: A fine-grained body biasing capable DRP. In 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings [7503676] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CoolChips.2016.7503676

MuCCRA4-BB : A fine-grained body biasing capable DRP. / Kuhn, Johannes Maximilian; Ben Ahmed, Akram; Okuhara, Hayate; Amano, Hideharu; Bringmann, Oliver; Rosenstiel, Wolfgang.

19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. 7503676.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kuhn, JM, Ben Ahmed, A, Okuhara, H, Amano, H, Bringmann, O & Rosenstiel, W 2016, MuCCRA4-BB: A fine-grained body biasing capable DRP. in 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings., 7503676, Institute of Electrical and Electronics Engineers Inc., 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016, Yokohama, Japan, 16/4/20. https://doi.org/10.1109/CoolChips.2016.7503676

@inproceedings{2ff28c7e3c5a46b6ba1a0429b9b10c3a,

title = "MuCCRA4-BB: A fine-grained body biasing capable DRP",

abstract = "The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.",

author = "Kuhn, {Johannes Maximilian} and {Ben Ahmed}, Akram and Hayate Okuhara and Hideharu Amano and Oliver Bringmann and Wolfgang Rosenstiel",

year = "2016",

month = jul,

day = "5",

doi = "10.1109/CoolChips.2016.7503676",

language = "English",

booktitle = "19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 ; Conference date: 20-04-2016 Through 22-04-2016",

}

TY - GEN

T1 - MuCCRA4-BB

T2 - 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016

AU - Kuhn, Johannes Maximilian

AU - Ben Ahmed, Akram

AU - Okuhara, Hayate

AU - Amano, Hideharu

AU - Bringmann, Oliver

AU - Rosenstiel, Wolfgang

PY - 2016/7/5

Y1 - 2016/7/5

N2 - The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.

AB - The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.

UR - http://www.scopus.com/inward/record.url?scp=84982806248&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84982806248&partnerID=8YFLogxK

U2 - 10.1109/CoolChips.2016.7503676

DO - 10.1109/CoolChips.2016.7503676

M3 - Conference contribution

AN - SCOPUS:84982806248

BT - 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 20 April 2016 through 22 April 2016

ER -