TY - GEN
T1 - Multi-objective optimization for application mapping and body bias control on a CGRA
AU - Doan, Nguyen Anh Vu
AU - Matsushita, Yusuke
AU - Ando, Naoki
AU - Okuhara, Hayate
AU - Amano, Hideharu
N1 - Funding Information:
ACKNOWLEDGMENT This work has been supported by JSPS KAKENHI S Grant Number 25220002, and also by VDEC from the University of Tokyo in collaboration with Cadence Design Systems, Inc. The stay of Ng. Anh Vu Doan in Keio University has been supported by the Erasmus Mundus EASED programme (Grant 2012-5538/004-001) coordinated by CentraleSuplec.
Publisher Copyright:
© 2017 IEEE.
PY - 2018/3/26
Y1 - 2018/3/26
N2 - Body biasing can be used to control the leakage power and the performance of transistors by changing the threshold voltage after fabrication. Especially, a new process called Silicon-On-Thin BOX (SOTB) CMOS can control the balance of these two factors. When it is applied to a Coarse-Grained Reconfigurable Array (CGRA), the leakage power can be largely reduced by controlling precisely the bias with small domain size. On the other hand, the choices on bias voltages depend on the application executed on the platform, especially its mapping. In this paper, we propose to apply a multi-objective optimization for the application mapping and the body bias control on an energy efficient CGRA called CC-SOTB (Cool Mega Array Cube-SOTB). By using an NSGA-II algorithm for the mapping exploration and Integer Linear Programming (ILP) for the body bias control optimization, we show that it is possible to achieve better power consumption results than in previous works. For instance, in the case of a domain size of 2 rows by 1 column, it is possible to achieve a power reduction ratio up to 43.25%, compared to 21.09% previously, for the studied application. This is however achieved at the cost of a bigger mapping width. Nonetheless, the exploration allows to have finer analyses about both mapping and consumption. Indeed, these promising results show that optimizing the application mapping simultaneously with the body bias control can provide more interesting results, giving deeper quantitative information about trade-off possibilities.
AB - Body biasing can be used to control the leakage power and the performance of transistors by changing the threshold voltage after fabrication. Especially, a new process called Silicon-On-Thin BOX (SOTB) CMOS can control the balance of these two factors. When it is applied to a Coarse-Grained Reconfigurable Array (CGRA), the leakage power can be largely reduced by controlling precisely the bias with small domain size. On the other hand, the choices on bias voltages depend on the application executed on the platform, especially its mapping. In this paper, we propose to apply a multi-objective optimization for the application mapping and the body bias control on an energy efficient CGRA called CC-SOTB (Cool Mega Array Cube-SOTB). By using an NSGA-II algorithm for the mapping exploration and Integer Linear Programming (ILP) for the body bias control optimization, we show that it is possible to achieve better power consumption results than in previous works. For instance, in the case of a domain size of 2 rows by 1 column, it is possible to achieve a power reduction ratio up to 43.25%, compared to 21.09% previously, for the studied application. This is however achieved at the cost of a bigger mapping width. Nonetheless, the exploration allows to have finer analyses about both mapping and consumption. Indeed, these promising results show that optimizing the application mapping simultaneously with the body bias control can provide more interesting results, giving deeper quantitative information about trade-off possibilities.
KW - Application Mapping
KW - Body Bias Control
KW - Coarse-Grained Reconfigurable Array
KW - Multi-Objective Optimization
UR - http://www.scopus.com/inward/record.url?scp=85049727171&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049727171&partnerID=8YFLogxK
U2 - 10.1109/MCSoC.2017.20
DO - 10.1109/MCSoC.2017.20
M3 - Conference contribution
AN - SCOPUS:85049727171
T3 - Proceedings - IEEE 11th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2017
SP - 143
EP - 150
BT - Proceedings - IEEE 11th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2017
Y2 - 18 September 2017 through 20 September 2017
ER -