Abstract
Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
Original language | English |
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Pages (from-to) | 194-201 |
Number of pages | 8 |
Journal | Sensors and Actuators, A: Physical |
Volume | 103 |
Issue number | 1-2 |
DOIs | |
Publication status | Published - 2003 Jan 15 |
Externally published | Yes |
Keywords
- 3D structure
- Multi-stack wafer bonding
- Silicon-direct bonding
- Wafer bonding
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering