Abstract
Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
| Original language | English |
|---|---|
| Pages (from-to) | 194-201 |
| Number of pages | 8 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 103 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 2003 Jan 15 |
| Externally published | Yes |
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Keywords
- 3D structure
- Multi-stack wafer bonding
- Silicon-direct bonding
- Wafer bonding
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
- Instrumentation
Cite this
Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing. / Miki, Norihisa; Zhang, X.; Khanna, R.; Ayón, A. A.; Ward, D.; Spearing, S. M.
In: Sensors and Actuators, A: Physical, Vol. 103, No. 1-2, 15.01.2003, p. 194-201.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing
AU - Miki, Norihisa
AU - Zhang, X.
AU - Khanna, R.
AU - Ayón, A. A.
AU - Ward, D.
AU - Spearing, S. M.
PY - 2003/1/15
Y1 - 2003/1/15
N2 - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
AB - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
KW - 3D structure
KW - Multi-stack wafer bonding
KW - Silicon-direct bonding
KW - Wafer bonding
UR - http://www.scopus.com/inward/record.url?scp=0037438778&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0037438778&partnerID=8YFLogxK
U2 - 10.1016/S0924-4247(02)00332-1
DO - 10.1016/S0924-4247(02)00332-1
M3 - Article
AN - SCOPUS:0037438778
VL - 103
SP - 194
EP - 201
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
IS - 1-2
ER -