Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

N. Miki; X. Zhang; R. Khanna; A. A. Ayón; D. Ward; S. M. Spearing

doi:10.1016/S0924-4247(02)00332-1

Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

N. Miki, X. Zhang, R. Khanna, A. A. Ayón, D. Ward, S. M. Spearing

Research output: Contribution to journal › Article › peer-review

69 Citations (Scopus)

Abstract

Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

Original language	English
Pages (from-to)	194-201
Number of pages	8
Journal	Sensors and Actuators, A: Physical
Volume	103
Issue number	1-2
DOIs	https://doi.org/10.1016/S0924-4247(02)00332-1
Publication status	Published - 2003 Jan 15
Externally published	Yes

Keywords

3D structure
Multi-stack wafer bonding
Silicon-direct bonding
Wafer bonding

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Instrumentation
Condensed Matter Physics
Surfaces, Coatings and Films
Metals and Alloys
Electrical and Electronic Engineering

Access to Document

10.1016/S0924-4247(02)00332-1

Fingerprint Dive into the research topics of 'Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing'. Together they form a unique fingerprint.

Cite this

@article{1124fae77e354a4abe620fe80ae081cc,

title = "Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing",

abstract = "Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.",

keywords = "3D structure, Multi-stack wafer bonding, Silicon-direct bonding, Wafer bonding",

author = "N. Miki and X. Zhang and R. Khanna and Ay{\'o}n, {A. A.} and D. Ward and Spearing, {S. M.}",

note = "Funding Information: This work is supported by the Army Research Office (DAAH04-95-1-0093) under Dr. R. Paur and by DARPA (DAAG55-98-1-0365, DABT63-98-C-0004) under Dr. R. Nowack and Dr. J. McMichael, respectively. The authors thank Tom Takacs, Linhvu Ho, and Kurt Broderick for their help in fabrication. ",

year = "2003",

month = jan,

day = "15",

doi = "10.1016/S0924-4247(02)00332-1",

language = "English",

volume = "103",

pages = "194--201",

journal = "Sensors and Actuators, A: Physical",

issn = "0924-4247",

publisher = "Elsevier",

number = "1-2",

}

TY - JOUR

T1 - Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

AU - Miki, N.

AU - Zhang, X.

AU - Khanna, R.

AU - Ayón, A. A.

AU - Ward, D.

AU - Spearing, S. M.

N1 - Funding Information: This work is supported by the Army Research Office (DAAH04-95-1-0093) under Dr. R. Paur and by DARPA (DAAG55-98-1-0365, DABT63-98-C-0004) under Dr. R. Nowack and Dr. J. McMichael, respectively. The authors thank Tom Takacs, Linhvu Ho, and Kurt Broderick for their help in fabrication.

PY - 2003/1/15

Y1 - 2003/1/15

N2 - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

AB - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

KW - 3D structure

KW - Multi-stack wafer bonding

KW - Silicon-direct bonding

KW - Wafer bonding

UR - http://www.scopus.com/inward/record.url?scp=0037438778&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037438778&partnerID=8YFLogxK

U2 - 10.1016/S0924-4247(02)00332-1

DO - 10.1016/S0924-4247(02)00332-1

M3 - Article

AN - SCOPUS:0037438778

VL - 103

SP - 194

EP - 201

JO - Sensors and Actuators, A: Physical

JF - Sensors and Actuators, A: Physical

SN - 0924-4247

IS - 1-2

ER -