TY - JOUR
T1 - Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing
AU - Miki, N.
AU - Zhang, X.
AU - Khanna, R.
AU - Ayón, A. A.
AU - Ward, D.
AU - Spearing, S. M.
N1 - Funding Information:
This work is supported by the Army Research Office (DAAH04-95-1-0093) under Dr. R. Paur and by DARPA (DAAG55-98-1-0365, DABT63-98-C-0004) under Dr. R. Nowack and Dr. J. McMichael, respectively. The authors thank Tom Takacs, Linhvu Ho, and Kurt Broderick for their help in fabrication.
Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2003/1/15
Y1 - 2003/1/15
N2 - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
AB - Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional (3D) microstructures. However, there are several bonding issues that have to be faced and overcome to build multilayered structures successfully. Among these are: (1) chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding; (2) increased stiffness due to multiple bonded wafers and/or thick wafers; (3) bonding tool effects; (4) defect propagation to other wafer-levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any microelectromechanical systems project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
KW - 3D structure
KW - Multi-stack wafer bonding
KW - Silicon-direct bonding
KW - Wafer bonding
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U2 - 10.1016/S0924-4247(02)00332-1
DO - 10.1016/S0924-4247(02)00332-1
M3 - Article
AN - SCOPUS:0037438778
VL - 103
SP - 194
EP - 201
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
IS - 1-2
ER -