Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate

Naoaki Yamanaka, Shiro Kikuchi, Taichi Kon, Takaaki Ohsaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

28 Citations (Scopus)

Abstract

A high-speed multichip 32 × 32 space-division switching module for high-definition TV broadcasting and switching systems is described. This module employs a novel Si-bipolar SST (super self-aligned process technology) switching LSI and a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors. The substrate contains matrix-shaped thin-film resistors for terminated transmission and has a spiral via hole structure to increase fabrication reliability. The module has 50-Ω characteristic impedance transmission lines that have a small deviation of less than 2.5%. The multichip module can handle a signal speed of 1.8 Gb/s using 1:1 and 1:n connections. Performance results confirm that this module will be suitable for future B-ISDN (broadband integrated services digital network) communication systems.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherPubl by IEEE
Pages562-570
Number of pages9
Volume1
Publication statusPublished - 1990
Externally publishedYes
Event1990 Proceedings of the 40th Electronic Components and Technology Conference - Las Vegas, NV, USA
Duration: 1990 May 201990 May 23

Other

Other1990 Proceedings of the 40th Electronic Components and Technology Conference
CityLas Vegas, NV, USA
Period90/5/2090/5/23

Fingerprint

Polyimides
Multilayers
Copper
Multichip modules
Switching systems
Voice/data communication systems
Substrates
Broadcasting
Resistors
Electric lines
Communication systems
Fabrication
Thin films

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yamanaka, N., Kikuchi, S., Kon, T., & Ohsaki, T. (1990). Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate. In Proceedings - Electronic Components and Technology Conference (Vol. 1, pp. 562-570). Publ by IEEE.

Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate. / Yamanaka, Naoaki; Kikuchi, Shiro; Kon, Taichi; Ohsaki, Takaaki.

Proceedings - Electronic Components and Technology Conference. Vol. 1 Publ by IEEE, 1990. p. 562-570.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamanaka, N, Kikuchi, S, Kon, T & Ohsaki, T 1990, Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate. in Proceedings - Electronic Components and Technology Conference. vol. 1, Publ by IEEE, pp. 562-570, 1990 Proceedings of the 40th Electronic Components and Technology Conference, Las Vegas, NV, USA, 90/5/20.
Yamanaka N, Kikuchi S, Kon T, Ohsaki T. Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate. In Proceedings - Electronic Components and Technology Conference. Vol. 1. Publ by IEEE. 1990. p. 562-570
Yamanaka, Naoaki ; Kikuchi, Shiro ; Kon, Taichi ; Ohsaki, Takaaki. / Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate. Proceedings - Electronic Components and Technology Conference. Vol. 1 Publ by IEEE, 1990. pp. 562-570
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