Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

N. Shishido, H. Sugiyama, S. Kamiya, H. Sato, K. Koiwa, M. Nishida, Masaki Omiya, T. Nagasawa, T. Nokuo, T. Suzuki, T. Nakamura

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)766-767
Number of pages2
JournalMicroscopy and Microanalysis
Volume18
DOIs
Publication statusPublished - 2012

ASJC Scopus subject areas

  • Instrumentation

Cite this

Shishido, N., Sugiyama, H., Kamiya, S., Sato, H., Koiwa, K., Nishida, M., Omiya, M., Nagasawa, T., Nokuo, T., Suzuki, T., & Nakamura, T. (2012). Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects. Microscopy and Microanalysis, 18, 766-767. https://doi.org/10.1017/S1431927612005685