Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

N. Shishido, H. Sugiyama, S. Kamiya, H. Sato, K. Koiwa, M. Nishida, Masaki Omiya, T. Nagasawa, T. Nokuo, T. Suzuki, T. Nakamura

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)766-767
Number of pages2
JournalMicroscopy and Microanalysis
Volume18
DOIs
Publication statusPublished - 2012

Fingerprint

large scale integration
Bond strength (materials)
adhesion
evaluation

ASJC Scopus subject areas

  • Instrumentation

Cite this

Shishido, N., Sugiyama, H., Kamiya, S., Sato, H., Koiwa, K., Nishida, M., ... Nakamura, T. (2012). Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects. Microscopy and Microanalysis, 18, 766-767. https://doi.org/10.1017/S1431927612005685

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects. / Shishido, N.; Sugiyama, H.; Kamiya, S.; Sato, H.; Koiwa, K.; Nishida, M.; Omiya, Masaki; Nagasawa, T.; Nokuo, T.; Suzuki, T.; Nakamura, T.

In: Microscopy and Microanalysis, Vol. 18, 2012, p. 766-767.

Research output: Contribution to journalArticle

Shishido, N, Sugiyama, H, Kamiya, S, Sato, H, Koiwa, K, Nishida, M, Omiya, M, Nagasawa, T, Nokuo, T, Suzuki, T & Nakamura, T 2012, 'Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects', Microscopy and Microanalysis, vol. 18, pp. 766-767. https://doi.org/10.1017/S1431927612005685
Shishido, N. ; Sugiyama, H. ; Kamiya, S. ; Sato, H. ; Koiwa, K. ; Nishida, M. ; Omiya, Masaki ; Nagasawa, T. ; Nokuo, T. ; Suzuki, T. ; Nakamura, T. / Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects. In: Microscopy and Microanalysis. 2012 ; Vol. 18. pp. 766-767.
@article{7fdb7a23eab648f8bfdf854a8feb83a0,
title = "Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects",
author = "N. Shishido and H. Sugiyama and S. Kamiya and H. Sato and K. Koiwa and M. Nishida and Masaki Omiya and T. Nagasawa and T. Nokuo and T. Suzuki and T. Nakamura",
year = "2012",
doi = "10.1017/S1431927612005685",
language = "English",
volume = "18",
pages = "766--767",
journal = "Microscopy and Microanalysis",
issn = "1431-9276",
publisher = "Cambridge University Press",

}

TY - JOUR

T1 - Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

AU - Shishido, N.

AU - Sugiyama, H.

AU - Kamiya, S.

AU - Sato, H.

AU - Koiwa, K.

AU - Nishida, M.

AU - Omiya, Masaki

AU - Nagasawa, T.

AU - Nokuo, T.

AU - Suzuki, T.

AU - Nakamura, T.

PY - 2012

Y1 - 2012

UR - http://www.scopus.com/inward/record.url?scp=85007943307&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85007943307&partnerID=8YFLogxK

U2 - 10.1017/S1431927612005685

DO - 10.1017/S1431927612005685

M3 - Article

AN - SCOPUS:85007943307

VL - 18

SP - 766

EP - 767

JO - Microscopy and Microanalysis

JF - Microscopy and Microanalysis

SN - 1431-9276

ER -