Nanoindentation and diamond turning tests on compound semiconductor InP

Jiwang Yan, Hongwei Zhao, Tsunemoto Kuriyagawa, Jun'ichi Tamaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Nanoindentation tests were made on single-crystal InP at various loads using a pyramid-type diamond indenter, and the resulting indents were examined using SEM and TEM. The results suggest that dislocations along the <110> directions dominate the deformation mechanism, where no phase transformation occurs. Indentation caused high-density dislocation regions below which are slip bands. The indentation mechanism was simulated by finite element method (FEM), and the simulation results were compared with the experimental results. Diamond turning experiments were also conducted to examine the ductile machining characteristics. The surface texture was found to change significantly with workpiece crystal orientations. The critical undeformed chip thickness for completely ductile-cut surfaces was measured and smooth surfaces were obtained with generating continuous ductile chips.

Original languageEnglish
Title of host publicationProceedings of the 6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2006
EditorsH. Zervos
Publishereuspen
Pages276-279
Number of pages4
ISBN (Electronic)0955308208, 9780955308208
Publication statusPublished - 2006 Jan 1
Externally publishedYes
Event6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2006 - Baden bei Wien, Vienna, Austria
Duration: 2006 May 282006 Jun 1

Publication series

NameProceedings of the 6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2006
Volume2

Other

Other6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2006
CountryAustria
CityBaden bei Wien, Vienna
Period06/5/2806/6/1

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Science(all)
  • Mechanical Engineering
  • Instrumentation
  • Environmental Engineering

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