Nanometric cutting of single crystal silicon for large-diameter aspheric optical element

Jiwang Yan, Jun'ichi Tamaki, Katsuo Syoji, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new method for diamond turning aspheric surfaces on hard brittle materials, termed the straight-line enveloping method (SLEM), is proposed. In this method, the aspheric surface is generated using a straight-nosed diamond tool on a three-axis simultaneous control ultra-precision machine tool. This tool geometry enables thinning of the chip in the nanometric range at the same time provides significant width to undeformed chip thickness ratio to ensure plane strain conditions. The cutting experiment of a large single crystal silicon aspheric lens is described. It is demonstrated that the proposed method significantly improves machining efficiency, accuracy and lowers tool wear.

Original languageEnglish
Title of host publicationProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
EditorsD. Guo, D. Wang, Z. Jia, J. Wang, D. Guo, D. Wang, Z. Jia, J. Wang
Pages25-28
Number of pages4
Publication statusPublished - 2002
Externally publishedYes
EventProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002) - Dalian, China
Duration: 2002 Jul 102002 Jul 12

Other

OtherProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
CountryChina
CityDalian
Period02/7/1002/7/12

Fingerprint

Optical devices
Single crystals
Silicon
Diamonds
Brittleness
Machine tools
Lenses
Machining
Wear of materials
Geometry
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yan, J., Tamaki, J., Syoji, K., & Kuriyagawa, T. (2002). Nanometric cutting of single crystal silicon for large-diameter aspheric optical element. In D. Guo, D. Wang, Z. Jia, J. Wang, D. Guo, D. Wang, Z. Jia, ... J. Wang (Eds.), Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002) (pp. 25-28)

Nanometric cutting of single crystal silicon for large-diameter aspheric optical element. / Yan, Jiwang; Tamaki, Jun'ichi; Syoji, Katsuo; Kuriyagawa, Tsunemoto.

Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002). ed. / D. Guo; D. Wang; Z. Jia; J. Wang; D. Guo; D. Wang; Z. Jia; J. Wang. 2002. p. 25-28.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yan, J, Tamaki, J, Syoji, K & Kuriyagawa, T 2002, Nanometric cutting of single crystal silicon for large-diameter aspheric optical element. in D Guo, D Wang, Z Jia, J Wang, D Guo, D Wang, Z Jia & J Wang (eds), Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002). pp. 25-28, Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002), Dalian, China, 02/7/10.
Yan J, Tamaki J, Syoji K, Kuriyagawa T. Nanometric cutting of single crystal silicon for large-diameter aspheric optical element. In Guo D, Wang D, Jia Z, Wang J, Guo D, Wang D, Jia Z, Wang J, editors, Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002). 2002. p. 25-28
Yan, Jiwang ; Tamaki, Jun'ichi ; Syoji, Katsuo ; Kuriyagawa, Tsunemoto. / Nanometric cutting of single crystal silicon for large-diameter aspheric optical element. Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002). editor / D. Guo ; D. Wang ; Z. Jia ; J. Wang ; D. Guo ; D. Wang ; Z. Jia ; J. Wang. 2002. pp. 25-28
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