Near-field coupling integration technology

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Invention of IC was driven by "Tyranny of Numbers", a challenge implied by large number of interconnects in a large-scale system. Modern ICs integrate many miles of wiring and billions of contacts. Moore's Law, however, will die, and we cannot rely just on integration on a chip. A revolutionary solution of the connection problem is now needed for further integration. Our proposal, as More-Than-Moore, is to replace mechanical connection using wiring, solder, and connectors by electrical one using near-field coupling. Transmission Line Coupler by electromagnetic coupling for module connection and ThruChip Interface by inductive coupling for chip stacking is presented and discussed in this paper.

Original languageEnglish
Title of host publicationInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3)
PublisherElectrochemical Society Inc.
Pages83-91
Number of pages9
Volume72
Edition3
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2016
EventInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting - San Diego, United States
Duration: 2016 May 292016 Jun 2

Other

OtherInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting
CountryUnited States
CitySan Diego
Period16/5/2916/6/2

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kuroda, T. (2016). Near-field coupling integration technology. In International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) (3 ed., Vol. 72, pp. 83-91). Electrochemical Society Inc.. https://doi.org/10.1149/07203.0083ecst