Near-field coupling integration technology

Tadahiro Kuroda

doi:10.1149/07203.0083ecst

Near-field coupling integration technology

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Invention of IC was driven by "Tyranny of Numbers", a challenge implied by large number of interconnects in a large-scale system. Modern ICs integrate many miles of wiring and billions of contacts. Moore's Law, however, will die, and we cannot rely just on integration on a chip. A revolutionary solution of the connection problem is now needed for further integration. Our proposal, as More-Than-Moore, is to replace mechanical connection using wiring, solder, and connectors by electrical one using near-field coupling. Transmission Line Coupler by electromagnetic coupling for module connection and ThruChip Interface by inductive coupling for chip stacking is presented and discussed in this paper.

Original language	English
Title of host publication	International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3)
Editors	Y. S. Obeng, T. Hiramoto, G. Banerjee, P. Hesketh, A. Hoff, P. Srinivasan
Publisher	Electrochemical Society Inc.
Pages	83-91
Number of pages	9
Edition	3
ISBN (Electronic)	9781607687139
DOIs	https://doi.org/10.1149/07203.0083ecst
Publication status	Published - 2016
Event	International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting - San Diego, United States Duration: 2016 May 29 → 2016 Jun 2

Publication series

Name	ECS Transactions
Number	3
Volume	72
ISSN (Print)	1938-6737
ISSN (Electronic)	1938-5862

Other

Other	International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting
Country/Territory	United States
City	San Diego
Period	16/5/29 → 16/6/2

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1149/07203.0083ecst

Cite this

Kuroda, T. (2016). Near-field coupling integration technology. In Y. S. Obeng, T. Hiramoto, G. Banerjee, P. Hesketh, A. Hoff, & P. Srinivasan (Eds.), International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) (3 ed., pp. 83-91). (ECS Transactions; Vol. 72, No. 3). Electrochemical Society Inc.. https://doi.org/10.1149/07203.0083ecst

Near-field coupling integration technology. / Kuroda, Tadahiro.
International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). ed. / Y. S. Obeng; T. Hiramoto; G. Banerjee; P. Hesketh; A. Hoff; P. Srinivasan. 3. ed. Electrochemical Society Inc., 2016. p. 83-91 (ECS Transactions; Vol. 72, No. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kuroda, T 2016, Near-field coupling integration technology. in YS Obeng, T Hiramoto, G Banerjee, P Hesketh, A Hoff & P Srinivasan (eds), International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). 3 edn, ECS Transactions, no. 3, vol. 72, Electrochemical Society Inc., pp. 83-91, International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting, San Diego, United States, 16/5/29. https://doi.org/10.1149/07203.0083ecst

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Near-field coupling integration technology

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