Near-field wireless connection for 3D-system integration

Tadahiro Kuroda

doi:10.1109/VLSIT.2012.6242483

Near-field wireless connection for 3D-system integration

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.

Original language	English
Title of host publication	2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers
Pages	105-106
Number of pages	2
DOIs	https://doi.org/10.1109/VLSIT.2012.6242483
Publication status	Published - 2012 Sep 27
Event	2012 Symposium on VLSI Technology, VLSIT 2012 - Honolulu, HI, United States Duration: 2012 Jun 12 → 2012 Jun 14

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
ISSN (Print)	0743-1562

Other

Other	2012 Symposium on VLSI Technology, VLSIT 2012
Country	United States
City	Honolulu, HI
Period	12/6/12 → 12/6/14

Fingerprint

Keywords

3D IC
inductive coupling
near field

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

Kuroda, T. (2012). Near-field wireless connection for 3D-system integration. In 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers (pp. 105-106). [6242483] (Digest of Technical Papers - Symposium on VLSI Technology). https://doi.org/10.1109/VLSIT.2012.6242483

@inproceedings{ca97793aa9e44caeb87c2e9b2b7a9e5b,

title = "Near-field wireless connection for 3D-system integration",

abstract = "This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.",

keywords = "3D IC, inductive coupling, near field",

author = "Tadahiro Kuroda",

year = "2012",

month = sep,

day = "27",

doi = "10.1109/VLSIT.2012.6242483",

language = "English",

isbn = "9781467308458",

series = "Digest of Technical Papers - Symposium on VLSI Technology",

pages = "105--106",

booktitle = "2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers",

note = "2012 Symposium on VLSI Technology, VLSIT 2012 ; Conference date: 12-06-2012 Through 14-06-2012",

}

TY - GEN

T1 - Near-field wireless connection for 3D-system integration

AU - Kuroda, Tadahiro

PY - 2012/9/27

Y1 - 2012/9/27

N2 - This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.

AB - This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.

KW - 3D IC

KW - inductive coupling

KW - near field

UR - http://www.scopus.com/inward/record.url?scp=84866560575&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866560575&partnerID=8YFLogxK

U2 - 10.1109/VLSIT.2012.6242483

DO - 10.1109/VLSIT.2012.6242483

M3 - Conference contribution

AN - SCOPUS:84866560575

SN - 9781467308458

T3 - Digest of Technical Papers - Symposium on VLSI Technology

SP - 105

EP - 106

BT - 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers

T2 - 2012 Symposium on VLSI Technology, VLSIT 2012

Y2 - 12 June 2012 through 14 June 2012

ER -

Access to Document

10.1109/VLSIT.2012.6242483