@inproceedings{ca97793aa9e44caeb87c2e9b2b7a9e5b,
title = "Near-field wireless connection for 3D-system integration",
abstract = "This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.",
keywords = "3D IC, inductive coupling, near field",
author = "Tadahiro Kuroda",
year = "2012",
month = sep,
day = "27",
doi = "10.1109/VLSIT.2012.6242483",
language = "English",
isbn = "9781467308458",
series = "Digest of Technical Papers - Symposium on VLSI Technology",
pages = "105--106",
booktitle = "2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers",
note = "2012 Symposium on VLSI Technology, VLSIT 2012 ; Conference date: 12-06-2012 Through 14-06-2012",
}