Near-field wireless connection for 3D-system integration

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.

    Original languageEnglish
    Title of host publication2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers
    Pages105-106
    Number of pages2
    DOIs
    Publication statusPublished - 2012 Sep 27
    Event2012 Symposium on VLSI Technology, VLSIT 2012 - Honolulu, HI, United States
    Duration: 2012 Jun 122012 Jun 14

    Publication series

    NameDigest of Technical Papers - Symposium on VLSI Technology
    ISSN (Print)0743-1562

    Other

    Other2012 Symposium on VLSI Technology, VLSIT 2012
    CountryUnited States
    CityHonolulu, HI
    Period12/6/1212/6/14

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    Keywords

    • 3D IC
    • inductive coupling
    • near field

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Kuroda, T. (2012). Near-field wireless connection for 3D-system integration. In 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers (pp. 105-106). [6242483] (Digest of Technical Papers - Symposium on VLSI Technology). https://doi.org/10.1109/VLSIT.2012.6242483