Near-field wireless connection for 3D-system integration

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.

Original languageEnglish
Title of host publicationDigest of Technical Papers - Symposium on VLSI Technology
Pages105-106
Number of pages2
DOIs
Publication statusPublished - 2012
Event2012 Symposium on VLSI Technology, VLSIT 2012 - Honolulu, HI, United States
Duration: 2012 Jun 122012 Jun 14

Other

Other2012 Symposium on VLSI Technology, VLSIT 2012
CountryUnited States
CityHonolulu, HI
Period12/6/1212/6/14

Fingerprint

Interfaces (computer)
Telecommunication links
Networks (circuits)

Keywords

  • 3D IC
  • inductive coupling
  • near field

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kuroda, T. (2012). Near-field wireless connection for 3D-system integration. In Digest of Technical Papers - Symposium on VLSI Technology (pp. 105-106). [6242483] https://doi.org/10.1109/VLSIT.2012.6242483

Near-field wireless connection for 3D-system integration. / Kuroda, Tadahiro.

Digest of Technical Papers - Symposium on VLSI Technology. 2012. p. 105-106 6242483.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2012, Near-field wireless connection for 3D-system integration. in Digest of Technical Papers - Symposium on VLSI Technology., 6242483, pp. 105-106, 2012 Symposium on VLSI Technology, VLSIT 2012, Honolulu, HI, United States, 12/6/12. https://doi.org/10.1109/VLSIT.2012.6242483
Kuroda T. Near-field wireless connection for 3D-system integration. In Digest of Technical Papers - Symposium on VLSI Technology. 2012. p. 105-106. 6242483 https://doi.org/10.1109/VLSIT.2012.6242483
Kuroda, Tadahiro. / Near-field wireless connection for 3D-system integration. Digest of Technical Papers - Symposium on VLSI Technology. 2012. pp. 105-106
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