Abstract
This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.
| Original language | English |
|---|---|
| Title of host publication | 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers |
| Pages | 105-106 |
| Number of pages | 2 |
| DOIs | |
| Publication status | Published - 2012 Sep 27 |
| Event | 2012 Symposium on VLSI Technology, VLSIT 2012 - Honolulu, HI, United States Duration: 2012 Jun 12 → 2012 Jun 14 |
Publication series
| Name | Digest of Technical Papers - Symposium on VLSI Technology |
|---|---|
| ISSN (Print) | 0743-1562 |
Other
| Other | 2012 Symposium on VLSI Technology, VLSIT 2012 |
|---|---|
| Country | United States |
| City | Honolulu, HI |
| Period | 12/6/12 → 12/6/14 |
Keywords
- 3D IC
- inductive coupling
- near field
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Kuroda, T. (2012). Near-field wireless connection for 3D-system integration. In 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers (pp. 105-106). [6242483] (Digest of Technical Papers - Symposium on VLSI Technology). https://doi.org/10.1109/VLSIT.2012.6242483