Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Citations (Scopus)

Abstract

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

Original languageEnglish
Title of host publication2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
Pages115-118
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 IEEE Asian Solid-State Circuits Conference, A-SSCC - Jeju, Korea, Republic of
Duration: 2007 Nov 122007 Nov 14

Publication series

Name2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

Other

Other2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
CountryKorea, Republic of
CityJeju
Period07/11/1207/11/14

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ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Yuxiang, Y., Yoshida, Y., & Kuroda, T. (2007). Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS. In 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC (pp. 115-118). [4425745] (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC). https://doi.org/10.1109/ASSCC.2007.4425745