Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    22 Citations (Scopus)

    Abstract

    This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

    Original languageEnglish
    Title of host publication2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
    Pages115-118
    Number of pages4
    DOIs
    Publication statusPublished - 2007 Dec 1
    Event2007 IEEE Asian Solid-State Circuits Conference, A-SSCC - Jeju, Korea, Republic of
    Duration: 2007 Nov 122007 Nov 14

    Publication series

    Name2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

    Other

    Other2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
    CountryKorea, Republic of
    CityJeju
    Period07/11/1207/11/14

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Yuxiang, Y., Yoshida, Y., & Kuroda, T. (2007). Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS. In 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC (pp. 115-118). [4425745] (2007 IEEE Asian Solid-State Circuits Conference, A-SSCC). https://doi.org/10.1109/ASSCC.2007.4425745