Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang; Yoichi Yoshida; Tadahiro Kuroda

doi:10.1109/ASSCC.2007.4425745

Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

22 Citations (Scopus)

Abstract

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

Original language	English
Title of host publication	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
Pages	115-118
Number of pages	4
DOIs	https://doi.org/10.1109/ASSCC.2007.4425745
Publication status	Published - 2007 Dec 1
Event	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC - Jeju, Korea, Republic of Duration: 2007 Nov 12 → 2007 Nov 14

Publication series

Name	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

Other

Other	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
Country/Territory	Korea, Republic of
City	Jeju
Period	07/11/12 → 07/11/14

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ASSCC.2007.4425745

Cite this

Yuxiang, Y, Yoshida, Y & Kuroda, T 2007, Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS. in 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC., 4425745, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, pp. 115-118, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, Jeju, Korea, Republic of, 07/11/12. https://doi.org/10.1109/ASSCC.2007.4425745

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title = "Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS",

abstract = "This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.",

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year = "2007",

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doi = "10.1109/ASSCC.2007.4425745",

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Y1 - 2007/12/1

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AB - This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

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M3 - Conference contribution

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T3 - 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

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BT - 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

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Y2 - 12 November 2007 through 14 November 2007

ER -

Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

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