Non-contact inter-chip data communications technology for system in a package

Research output: Contribution to conferencePaper

Abstract

A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.

Original languageEnglish
Pages1347-1352
Number of pages6
Publication statusPublished - 2004 Dec 1
Event2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004 - Beijing, China
Duration: 2004 Oct 182004 Oct 21

Other

Other2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004
CountryChina
CityBeijing
Period04/10/1804/10/21

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kuroda, T. (2004). Non-contact inter-chip data communications technology for system in a package. 1347-1352. Paper presented at 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004, Beijing, China.