Non-contact inter-chip data communications technology for system in a package

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.

Original languageEnglish
Title of host publicationInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
EditorsR. Huang, M. Yu, J.J. Liou, T. Hiramito, C. Claeys
Pages1347-1352
Number of pages6
Volume2
Publication statusPublished - 2004
Event2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004 - Beijing, China
Duration: 2004 Oct 182004 Oct 21

Other

Other2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004
CountryChina
CityBeijing
Period04/10/1804/10/21

Fingerprint

Transceivers
Networks (circuits)
Time division multiple access
Communication
Circuit theory
Magnetic fields
Detectors
Metals

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kuroda, T. (2004). Non-contact inter-chip data communications technology for system in a package. In R. Huang, M. Yu, J. J. Liou, T. Hiramito, & C. Claeys (Eds.), International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT (Vol. 2, pp. 1347-1352)

Non-contact inter-chip data communications technology for system in a package. / Kuroda, Tadahiro.

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. ed. / R. Huang; M. Yu; J.J. Liou; T. Hiramito; C. Claeys. Vol. 2 2004. p. 1347-1352.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2004, Non-contact inter-chip data communications technology for system in a package. in R Huang, M Yu, JJ Liou, T Hiramito & C Claeys (eds), International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. vol. 2, pp. 1347-1352, 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004, Beijing, China, 04/10/18.
Kuroda T. Non-contact inter-chip data communications technology for system in a package. In Huang R, Yu M, Liou JJ, Hiramito T, Claeys C, editors, International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. Vol. 2. 2004. p. 1347-1352
Kuroda, Tadahiro. / Non-contact inter-chip data communications technology for system in a package. International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. editor / R. Huang ; M. Yu ; J.J. Liou ; T. Hiramito ; C. Claeys. Vol. 2 2004. pp. 1347-1352
@inproceedings{e14340a6e9054103b36e592bc67169e0,
title = "Non-contact inter-chip data communications technology for system in a package",
abstract = "A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.",
author = "Tadahiro Kuroda",
year = "2004",
language = "English",
volume = "2",
pages = "1347--1352",
editor = "R. Huang and M. Yu and J.J. Liou and T. Hiramito and C. Claeys",
booktitle = "International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT",

}

TY - GEN

T1 - Non-contact inter-chip data communications technology for system in a package

AU - Kuroda, Tadahiro

PY - 2004

Y1 - 2004

N2 - A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.

AB - A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.

UR - http://www.scopus.com/inward/record.url?scp=21644481496&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=21644481496&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:21644481496

VL - 2

SP - 1347

EP - 1352

BT - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

A2 - Huang, R.

A2 - Yu, M.

A2 - Liou, J.J.

A2 - Hiramito, T.

A2 - Claeys, C.

ER -