Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

Shintaro Sato, Mizuhisa Nihei, Atsushi Mimura, Akio Kawabata, Daiyu Kondo, Hiroki Shioya, Taisuke Iwai, Mino Mishima, Mari Ohniti, Yuji Awano

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    93 Citations (Scopus)

    Abstract

    We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst.

    Original languageEnglish
    Title of host publication2006 International Interconnect Technology Conference, IITC
    Pages230-232
    Number of pages3
    DOIs
    Publication statusPublished - 2006
    Event2006 International Interconnect Technology Conference, IITC - Burlingame, CA, United States
    Duration: 2006 Jun 52006 Jun 7

    Publication series

    Name2006 International Interconnect Technology Conference, IITC

    Other

    Other2006 International Interconnect Technology Conference, IITC
    CountryUnited States
    CityBurlingame, CA
    Period06/6/506/6/7

    ASJC Scopus subject areas

    • Control and Systems Engineering
    • Electrical and Electronic Engineering

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  • Cite this

    Sato, S., Nihei, M., Mimura, A., Kawabata, A., Kondo, D., Shioya, H., Iwai, T., Mishima, M., Ohniti, M., & Awano, Y. (2006). Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles. In 2006 International Interconnect Technology Conference, IITC (pp. 230-232). [1648696] (2006 International Interconnect Technology Conference, IITC). https://doi.org/10.1109/IITC.2006.1648696