Numerical modeling of heatstroke in aged residents and incidence risk assessment considering thermal performance of housing envelope and living behavior

Yukiko Murakami, Toshiharu Ikaga, Shingo Hori, Masaru Suzuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We measured temperature and relative humidity in the house of a heatstroke patient and developed a body temperature simulation model for aged residents. The measurement results suggested that if air temperature is not excessively high, the indoor temperature of the previous day will persist until the following day. Moreover, we assessed the incidence risk of heatstroke in aged residents considering thermal performance of the housing envelope and living behavior. Results showed that reducing the quantity of radiation and increasing airflow can lower the incidence risk of heatstroke.

Original languageEnglish
Title of host publication12th International Conference on Indoor Air Quality and Climate 2011
Pages1848-1853
Number of pages6
Publication statusPublished - 2011 Dec 1
Event12th International Conference on Indoor Air Quality and Climate 2011 - Austin, TX, United States
Duration: 2011 Jun 52011 Jun 10

Publication series

Name12th International Conference on Indoor Air Quality and Climate 2011
Volume3

Other

Other12th International Conference on Indoor Air Quality and Climate 2011
CountryUnited States
CityAustin, TX
Period11/6/511/6/10

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Keywords

  • Aged residents
  • Body temperature
  • Heatstroke
  • Living behavior
  • Numerical model
  • Thermal performance of the housing envelope

ASJC Scopus subject areas

  • Pollution

Cite this

Murakami, Y., Ikaga, T., Hori, S., & Suzuki, M. (2011). Numerical modeling of heatstroke in aged residents and incidence risk assessment considering thermal performance of housing envelope and living behavior. In 12th International Conference on Indoor Air Quality and Climate 2011 (pp. 1848-1853). (12th International Conference on Indoor Air Quality and Climate 2011; Vol. 3).