Numerical simulations of high heat dissipation technology in LSI 3-D packaging using carbon nanotube through silicon via (CNT-TSV) and thermal interface material (CNT-TIM)

Teppei Kawanabe, Akio Kawabata, Torno Murakami, Mizuhisa Nihei, Yuji Awano

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    2 Citations (Scopus)

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    Engineering & Materials Science