On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

J. Yan; M. Yoshino; T. Kuriagawa; T. Shirakashi; K. Syoji; R. Komanduri

doi:10.1016/S0921-5093(00)01031-5

On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

J. Yan, M. Yoshino, T. Kuriagawa, T. Shirakashi, K. Syoji, R. Komanduri

Research output: Contribution to journal › Article

147 Citations (Scopus)

Abstract

The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

Original language	English
Pages (from-to)	230-234
Number of pages	5
Journal	Materials Science and Engineering A
Volume	297
Issue number	1-2
DOIs	https://doi.org/10.1016/S0921-5093(00)01031-5
Publication status	Published - 2001 Jan 15
Externally published	Yes

Fingerprint

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

Yan, J., Yoshino, M., Kuriagawa, T., Shirakashi, T., Syoji, K., & Komanduri, R. (2001). On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. Materials Science and Engineering A, 297(1-2), 230-234. https://doi.org/10.1016/S0921-5093(00)01031-5

@article{36f678d4e1fe42dcaefe40c1514edebf,

title = "On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications",

abstract = "The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.",

author = "J. Yan and M. Yoshino and T. Kuriagawa and T. Shirakashi and K. Syoji and R. Komanduri",

year = "2001",

month = jan,

day = "15",

doi = "10.1016/S0921-5093(00)01031-5",

language = "English",

volume = "297",

pages = "230--234",

journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",

issn = "0921-5093",

publisher = "Elsevier BV",

number = "1-2",

}

TY - JOUR

T1 - On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

AU - Yan, J.

AU - Yoshino, M.

AU - Kuriagawa, T.

AU - Shirakashi, T.

AU - Syoji, K.

AU - Komanduri, R.

PY - 2001/1/15

Y1 - 2001/1/15

N2 - The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

AB - The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

UR - http://www.scopus.com/inward/record.url?scp=0035157059&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035157059&partnerID=8YFLogxK

U2 - 10.1016/S0921-5093(00)01031-5

DO - 10.1016/S0921-5093(00)01031-5

M3 - Article

AN - SCOPUS:0035157059

VL - 297

SP - 230

EP - 234

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

IS - 1-2

ER -

Access to Document

10.1016/S0921-5093(00)01031-5