On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

Jiwang Yan, M. Yoshino, T. Kuriagawa, T. Shirakashi, K. Syoji, R. Komanduri

Research output: Contribution to journalArticle

145 Citations (Scopus)

Abstract

The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

Original languageEnglish
Pages (from-to)230-234
Number of pages5
JournalMaterials Science and Engineering A
Volume297
Issue number1-2
DOIs
Publication statusPublished - 2001 Jan 15
Externally publishedYes

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Silicon
Hydrostatic pressure
machining
hydrostatic pressure
Machining
rakes
machine tools
Diamond
silicon
electronics
Machine tools
Diamonds
diamonds
chips
Single crystals
single crystals

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. / Yan, Jiwang; Yoshino, M.; Kuriagawa, T.; Shirakashi, T.; Syoji, K.; Komanduri, R.

In: Materials Science and Engineering A, Vol. 297, No. 1-2, 15.01.2001, p. 230-234.

Research output: Contribution to journalArticle

Yan, Jiwang ; Yoshino, M. ; Kuriagawa, T. ; Shirakashi, T. ; Syoji, K. ; Komanduri, R. / On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. In: Materials Science and Engineering A. 2001 ; Vol. 297, No. 1-2. pp. 230-234.
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