TY - JOUR
T1 - On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications
AU - Yan, J.
AU - Yoshino, M.
AU - Kuriagawa, T.
AU - Shirakashi, T.
AU - Syoji, K.
AU - Komanduri, R.
PY - 2001/1/15
Y1 - 2001/1/15
N2 - The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.
AB - The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.
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U2 - 10.1016/S0921-5093(00)01031-5
DO - 10.1016/S0921-5093(00)01031-5
M3 - Article
AN - SCOPUS:0035157059
VL - 297
SP - 230
EP - 234
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
IS - 1-2
ER -