On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

J. Yan, M. Yoshino, T. Kuriagawa, T. Shirakashi, K. Syoji, R. Komanduri

Research output: Contribution to journalArticle

149 Citations (Scopus)

Abstract

The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

Original languageEnglish
Pages (from-to)230-234
Number of pages5
JournalMaterials Science and Engineering A
Volume297
Issue number1-2
DOIs
Publication statusPublished - 2001 Jan 15
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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