Perspective of low-power and high-speed wireless inter-chip communications for SiP integration

Tadahiro Kuroda, Noriyuki Miura

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Citations (Scopus)

    Abstract

    Performance gap between computation in a chip and communication between chips is widening. "System in a Package" (SiP) reduces chip distance significantly, enabling a high-speed and low-power interface. Electrical non-contact interfaces using inductive/capacitive coupling have advantages over mechanical interfaces employing Through Silicon Vias (TSV) and micro bumps. In this paper, a perspective of using wireless links between stacked chips in a package is presented. Techniques for high-speed and low-power data communications are discussed in various levels from signaling, circuit design, IC layout, and magnetic field design, as well as cross talk analysis and its countermeasures. A 1Tb/s 3W transceiver in 0.18μm CMOS is presented. Both clock and data are transmitted by inductive coupling. 1024 data transceivers are arranged with a pitch of 30μm. A 4-phases Time Division Multiple Access (TDMA) technique reduces crosstalk effectively. Measured Bit Error Rate (BER) is lower than 10-13. Bi-Phase Modulation (BPM) is employed to improve noise immunity, resulting in power reduction.

    Original languageEnglish
    Title of host publicationESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference
    PublisherIEEE Computer Society
    Pages3-6
    Number of pages4
    ISBN (Print)1424403014, 9781424403011
    DOIs
    Publication statusPublished - 2006
    EventESSDERC 2006 - 36th European Solid-State Device Research Conference - Montreux, Switzerland
    Duration: 2006 Sep 192006 Sep 21

    Other

    OtherESSDERC 2006 - 36th European Solid-State Device Research Conference
    CountrySwitzerland
    CityMontreux
    Period06/9/1906/9/21

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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  • Cite this

    Kuroda, T., & Miura, N. (2006). Perspective of low-power and high-speed wireless inter-chip communications for SiP integration. In ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference (pp. 3-6). [4099847] IEEE Computer Society. https://doi.org/10.1109/ESSDER.2006.307629