Plasma etching and feature evolution of organic low-k material by using VicAddress

T. Makabe, T. Shimada, T. Yagisawa

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Plasma process is a highly selective technique exploiting the individual or mixed function of positive ions, electrons, neutral radicals, and photons produced by low temperature plasmas. For example, dielectric etching is a competitive process among charging, etching and deposition at each of local positions of a geometrical structure exposed to reactive plasmas. Plasma etching is adjacent to the damage, such as charging, thermal heating, and UV-irradiation, caused by these elements. VicAddress (Vertically integrated computer aided design for device processes) developed in our laboratory has a threefold frame, including two-dimensional (2D) plasma structure, particle sheath kinetics, and particle-wafer interaction, in the multi-scale system of the plasma process. We will discuss the numerical procedure of a plasma surface interaction for etching. Time-averaged 2D plasma in a two-frequency capacitively coupled plasma reactor of several cm in dimension is connected to the wafer surface having a pattern of a size of sub-micron. The influence of deposition on etching of organic low-k is numerically discussed in terms of the feature profile evolution.

Original languageEnglish
Pages (from-to)64-67
Number of pages4
JournalComputer Physics Communications
Volume177
Issue number1-2 SPEC. ISS.
DOIs
Publication statusPublished - 2007 Jul

Fingerprint

Plasma etching
plasma etching
computer aided design
Computer aided design
Plasmas
Etching
etching
Beam plasma interactions
charging
wafers
Plasma sheaths
cold plasmas
positive ions
sheaths
surface reactions
reactors
Photons
damage
Positive ions
Irradiation

Keywords

  • Competitive process between etching and deposition
  • Feature profile
  • Plasma etching

ASJC Scopus subject areas

  • Computer Science Applications
  • Physics and Astronomy(all)

Cite this

Plasma etching and feature evolution of organic low-k material by using VicAddress. / Makabe, T.; Shimada, T.; Yagisawa, T.

In: Computer Physics Communications, Vol. 177, No. 1-2 SPEC. ISS., 07.2007, p. 64-67.

Research output: Contribution to journalArticle

Makabe, T. ; Shimada, T. ; Yagisawa, T. / Plasma etching and feature evolution of organic low-k material by using VicAddress. In: Computer Physics Communications. 2007 ; Vol. 177, No. 1-2 SPEC. ISS. pp. 64-67.
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