Present status and future prospects of nano-carbon interconnect technologies for LSIs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.

Original languageEnglish
Title of host publicationTechnical Digest - International Electron Devices Meeting, IEDM
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages15.5.1-15.5.4
Volume2016-February
ISBN (Print)9781467398930
DOIs
Publication statusPublished - 2016 Feb 16
Event61st IEEE International Electron Devices Meeting, IEDM 2015 - Washington, United States
Duration: 2015 Dec 72015 Dec 9

Other

Other61st IEEE International Electron Devices Meeting, IEDM 2015
CountryUnited States
CityWashington
Period15/12/715/12/9

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry

Cite this

Awano, Y. (2016). Present status and future prospects of nano-carbon interconnect technologies for LSIs. In Technical Digest - International Electron Devices Meeting, IEDM (Vol. 2016-February, pp. 15.5.1-15.5.4). [7409705] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2015.7409705