Present status and future prospects of nano-carbon interconnect technologies for LSIs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.

Original languageEnglish
Title of host publicationTechnical Digest - International Electron Devices Meeting, IEDM
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages15.5.1-15.5.4
Volume2016-February
ISBN (Print)9781467398930
DOIs
Publication statusPublished - 2016 Feb 16
Event61st IEEE International Electron Devices Meeting, IEDM 2015 - Washington, United States
Duration: 2015 Dec 72015 Dec 9

Other

Other61st IEEE International Electron Devices Meeting, IEDM 2015
CountryUnited States
CityWashington
Period15/12/715/12/9

Fingerprint

large scale integration
compatibility
graphene
Carbon
carbon nanotubes
electrical properties
requirements
Carbon Nanotubes
fabrication
Graphite
carbon
Graphene
Carbon nanotubes
Electric properties
Fabrication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry

Cite this

Awano, Y. (2016). Present status and future prospects of nano-carbon interconnect technologies for LSIs. In Technical Digest - International Electron Devices Meeting, IEDM (Vol. 2016-February, pp. 15.5.1-15.5.4). [7409705] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2015.7409705

Present status and future prospects of nano-carbon interconnect technologies for LSIs. / Awano, Yuji.

Technical Digest - International Electron Devices Meeting, IEDM. Vol. 2016-February Institute of Electrical and Electronics Engineers Inc., 2016. p. 15.5.1-15.5.4 7409705.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Awano, Y 2016, Present status and future prospects of nano-carbon interconnect technologies for LSIs. in Technical Digest - International Electron Devices Meeting, IEDM. vol. 2016-February, 7409705, Institute of Electrical and Electronics Engineers Inc., pp. 15.5.1-15.5.4, 61st IEEE International Electron Devices Meeting, IEDM 2015, Washington, United States, 15/12/7. https://doi.org/10.1109/IEDM.2015.7409705
Awano Y. Present status and future prospects of nano-carbon interconnect technologies for LSIs. In Technical Digest - International Electron Devices Meeting, IEDM. Vol. 2016-February. Institute of Electrical and Electronics Engineers Inc. 2016. p. 15.5.1-15.5.4. 7409705 https://doi.org/10.1109/IEDM.2015.7409705
Awano, Yuji. / Present status and future prospects of nano-carbon interconnect technologies for LSIs. Technical Digest - International Electron Devices Meeting, IEDM. Vol. 2016-February Institute of Electrical and Electronics Engineers Inc., 2016. pp. 15.5.1-15.5.4
@inproceedings{2cc24d5feb474412b7a8dc5a37c6edfb,
title = "Present status and future prospects of nano-carbon interconnect technologies for LSIs",
abstract = "We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.",
author = "Yuji Awano",
year = "2016",
month = "2",
day = "16",
doi = "10.1109/IEDM.2015.7409705",
language = "English",
isbn = "9781467398930",
volume = "2016-February",
pages = "15.5.1--15.5.4",
booktitle = "Technical Digest - International Electron Devices Meeting, IEDM",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Present status and future prospects of nano-carbon interconnect technologies for LSIs

AU - Awano, Yuji

PY - 2016/2/16

Y1 - 2016/2/16

N2 - We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.

AB - We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=84963999537&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84963999537&partnerID=8YFLogxK

U2 - 10.1109/IEDM.2015.7409705

DO - 10.1109/IEDM.2015.7409705

M3 - Conference contribution

AN - SCOPUS:84963999537

SN - 9781467398930

VL - 2016-February

SP - 15.5.1-15.5.4

BT - Technical Digest - International Electron Devices Meeting, IEDM

PB - Institute of Electrical and Electronics Engineers Inc.

ER -