TY - GEN
T1 - Proximity IOs using inductive coupling
AU - Kuroda, Tadahiro
PY - 2011
Y1 - 2011
N2 - This paper presents an proximity IOs using inductive coupling, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This paper will cover basics, applications, and future perspectives of the TCI.
AB - This paper presents an proximity IOs using inductive coupling, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This paper will cover basics, applications, and future perspectives of the TCI.
KW - 3D integration
KW - Proximity communication
KW - SiP
KW - inductive coupling
KW - near field
UR - http://www.scopus.com/inward/record.url?scp=84857164114&partnerID=8YFLogxK
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U2 - 10.1109/RFIT.2011.6141767
DO - 10.1109/RFIT.2011.6141767
M3 - Conference contribution
AN - SCOPUS:84857164114
SN - 9781457705182
T3 - 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
SP - 37
EP - 40
BT - 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
T2 - 4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
Y2 - 30 November 2011 through 2 December 2011
ER -