Proximity IOs using inductive coupling

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents an proximity IOs using inductive coupling, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This paper will cover basics, applications, and future perspectives of the TCI.

Original languageEnglish
Title of host publication2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
Pages37-40
Number of pages4
DOIs
Publication statusPublished - 2011
Event4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011 - Beijing, China
Duration: 2011 Nov 302011 Dec 2

Other

Other4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
CountryChina
CityBeijing
Period11/11/3011/12/2

Fingerprint

Digital circuits
Energy dissipation
Costs

Keywords

  • 3D integration
  • inductive coupling
  • near field
  • Proximity communication
  • SiP

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Kuroda, T. (2011). Proximity IOs using inductive coupling. In 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011 (pp. 37-40). [6141767] https://doi.org/10.1109/RFIT.2011.6141767

Proximity IOs using inductive coupling. / Kuroda, Tadahiro.

2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011. 2011. p. 37-40 6141767.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2011, Proximity IOs using inductive coupling. in 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011., 6141767, pp. 37-40, 4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011, Beijing, China, 11/11/30. https://doi.org/10.1109/RFIT.2011.6141767
Kuroda T. Proximity IOs using inductive coupling. In 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011. 2011. p. 37-40. 6141767 https://doi.org/10.1109/RFIT.2011.6141767
Kuroda, Tadahiro. / Proximity IOs using inductive coupling. 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011. 2011. pp. 37-40
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