Proximity IOs using inductive coupling

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This paper presents an proximity IOs using inductive coupling, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This paper will cover basics, applications, and future perspectives of the TCI.

    Original languageEnglish
    Title of host publication2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
    Pages37-40
    Number of pages4
    DOIs
    Publication statusPublished - 2011
    Event4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011 - Beijing, China
    Duration: 2011 Nov 302011 Dec 2

    Publication series

    Name2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011

    Other

    Other4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
    CountryChina
    CityBeijing
    Period11/11/3011/12/2

    Keywords

    • 3D integration
    • Proximity communication
    • SiP
    • inductive coupling
    • near field

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Electrical and Electronic Engineering

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  • Cite this

    Kuroda, T. (2011). Proximity IOs using inductive coupling. In 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011 (pp. 37-40). [6141767] (2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011). https://doi.org/10.1109/RFIT.2011.6141767