Rendering Thermal Sensation of Fingertip by Using Spatial Information of Heat Sources

Yukiko Osawa, Seiichiro Katsura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To encourage interaction between a human and a robot, a technique of giving a thermal sensation is needed. In particular, the technique is important for the case of offering a sense of security such as nursing care robot and rehabilitation robot. Thermal sensation is perceived from the temporal and spatial information of heat sources. Therefore, the model included such information is needed to control multiple heat sources as a single system. In this paper, the fingerstall attached four heat sources was developed and its control method for rendering spatial thermal sensation is proposed. The four heat sources are attached to the copper plate, and the human finger is thermally stimulated by touching the plate. The temperature distribution on the copper plate is modeled based on a two- dimensional thermal diffusion equation, and spatial thermal sensation can be rendered using the proposed system. Some experiments were conducted to verify the proposed thermal system and its control system.

Original languageEnglish
Title of host publicationProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages620-625
Number of pages6
ISBN (Electronic)9781538636152
DOIs
Publication statusPublished - 2019 Apr 25
Event2019 IEEE/SICE International Symposium on System Integration, SII 2019 - Paris, France
Duration: 2019 Jan 142019 Jan 16

Publication series

NameProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019

Conference

Conference2019 IEEE/SICE International Symposium on System Integration, SII 2019
CountryFrance
CityParis
Period19/1/1419/1/16

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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  • Cite this

    Osawa, Y., & Katsura, S. (2019). Rendering Thermal Sensation of Fingertip by Using Spatial Information of Heat Sources. In Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019 (pp. 620-625). [8700450] (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SII.2019.8700450