Research on the effects of machining-induced subsurface damages on mono-crystalline silicon via molecular dynamics simulation

Engineering & Materials Science

• Molecular dynamics 100%
• Crystalline materials 93%
• Nanoindentation 80%
• Machining 70%
• Silicon 69%
• Computer simulation 48%
• Atoms 46%
• Morse potential 38%
• Crystal lattices 34%
• Diamond cutting tools 31%
• Phase transitions 23%
• Diamonds 22%
• Plastic deformation 19%
• Semiconductor materials 19%
• Hardness 17%
• Mechanical properties 14%
• Experiments 7%

Physics & Astronomy

• machining 93%
• nanoindentation 67%
• molecular dynamics 64%
• damage 63%
• silicon 47%
• diamonds 35%
• simulation 33%
• Morse potential 28%
• crystal lattices 22%
• atoms 22%
• phase transformations 19%
• plastic deformation 19%
• interactions 17%
• hardness 17%
• mechanical properties 14%
• radii 13%

Chemical Compounds

• Cutting Process 72%
• Molecular Dynamics 65%
• Simulation 56%
• Diamond 42%
• Morse Potential 35%
• Cutting Tool 32%
• Amorphous Material 30%
• Surface 28%
• Plastic Deformation 27%
• Semiconductor 16%
• Crystal Structure 11%