TY - GEN
T1 - Rotary coding for power reduction and S/N improvement in inductive-coupling data communication
AU - Radecki, A.
AU - Miura, N.
AU - Ishikuro, H.
AU - Kuroda, T.
PY - 2011/12/1
Y1 - 2011/12/1
N2 - We present a non-contact inductive-coupling data communication link employing a rotary data encoding scheme. The circuit consumes 50% less power and is inherently more robust to jitter than previously reported solutions. Applications include wafer-level testing, non-contact memory card interfaces and inter-strata data communication in 3D-integrated circuits.
AB - We present a non-contact inductive-coupling data communication link employing a rotary data encoding scheme. The circuit consumes 50% less power and is inherently more robust to jitter than previously reported solutions. Applications include wafer-level testing, non-contact memory card interfaces and inter-strata data communication in 3D-integrated circuits.
UR - http://www.scopus.com/inward/record.url?scp=84856332410&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84856332410&partnerID=8YFLogxK
U2 - 10.1109/ASSCC.2011.6123638
DO - 10.1109/ASSCC.2011.6123638
M3 - Conference contribution
AN - SCOPUS:84856332410
SN - 9781467303989
T3 - 2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011
SP - 205
EP - 208
BT - 2011 Proceedings of Technical Papers
T2 - 7th IEEE Asian Solid-State Circuits Conference, A-SSCC 2011
Y2 - 14 November 2011 through 16 November 2011
ER -