TY - GEN
T1 - Scalable deep neural network accelerator cores with cubic integration using through chip interface
AU - Sakamoto, Ryuichi
AU - Takata, Ryo
AU - Ishii, Jun
AU - Kondo, Masaaki
AU - Nakamura, Hiroshi
AU - Ohkubo, Tetsui
AU - Kojima, Takuya
AU - Amano, Hideharu
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2018/5/29
Y1 - 2018/5/29
N2 - Due to the recent advances in Deep Neural Network (DNN) technologies, recognition and inference applications are expected to run on mobile embedded systems. Developing high-performance and power-efficient DNN engines becomes one of the important challenges for embedded systems. Since DNN algorithms or structures are frequently updated, flexibility and performance scalability to deal with various types of networks are crucial requirement of the DNN accelerator design. In this paper, we describe the architecture and LSI design of a flexible and scalable CNN accelerator called SNACC (Scalable Neuro Accelerator Core with Cubic integration) which consists of several processing cores, on-chip memory modules, and ThruChip Interface (TCI).
AB - Due to the recent advances in Deep Neural Network (DNN) technologies, recognition and inference applications are expected to run on mobile embedded systems. Developing high-performance and power-efficient DNN engines becomes one of the important challenges for embedded systems. Since DNN algorithms or structures are frequently updated, flexibility and performance scalability to deal with various types of networks are crucial requirement of the DNN accelerator design. In this paper, we describe the architecture and LSI design of a flexible and scalable CNN accelerator called SNACC (Scalable Neuro Accelerator Core with Cubic integration) which consists of several processing cores, on-chip memory modules, and ThruChip Interface (TCI).
KW - 3D-Integration
KW - Accelerator
KW - CNN
KW - LSI Design
UR - http://www.scopus.com/inward/record.url?scp=85048872279&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048872279&partnerID=8YFLogxK
U2 - 10.1109/ISOCC.2017.8368843
DO - 10.1109/ISOCC.2017.8368843
M3 - Conference contribution
AN - SCOPUS:85048872279
T3 - Proceedings - International SoC Design Conference 2017, ISOCC 2017
SP - 155
EP - 156
BT - Proceedings - International SoC Design Conference 2017, ISOCC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th International SoC Design Conference, ISOCC 2017
Y2 - 5 November 2017 through 8 November 2017
ER -