Scalable deep neural network accelerator cores with cubic integration using through chip interface

Ryuichi Sakamoto, Ryo Takata, Jun Ishii, Masaaki Kondo, Hiroshi Nakamura, Tetsui Ohkubo, Takuya Kojima, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Due to the recent advances in Deep Neural Network (DNN) technologies, recognition and inference applications are expected to run on mobile embedded systems. Developing high-performance and power-efficient DNN engines becomes one of the important challenges for embedded systems. Since DNN algorithms or structures are frequently updated, flexibility and performance scalability to deal with various types of networks are crucial requirement of the DNN accelerator design. In this paper, we describe the architecture and LSI design of a flexible and scalable CNN accelerator called SNACC (Scalable Neuro Accelerator Core with Cubic integration) which consists of several processing cores, on-chip memory modules, and ThruChip Interface (TCI).

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages155-156
Number of pages2
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 52017 Nov 8

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/517/11/8

Keywords

  • 3D-Integration
  • Accelerator
  • CNN
  • LSI Design

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Sakamoto, R., Takata, R., Ishii, J., Kondo, M., Nakamura, H., Ohkubo, T., Kojima, T., & Amano, H. (2018). Scalable deep neural network accelerator cores with cubic integration using through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 155-156). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368843