TY - GEN
T1 - Shape Deformation Analysis of Single Cell in 3d Tissue under Mechanical Stimuli
AU - Kasahara, Keitaro
AU - Kurashina, Yuta
AU - Miura, Shigenori
AU - Miyata, Shogo
AU - Onoe, Hiroaki
N1 - Funding Information:
This work was partly supported by Keio University Special Grant-in-Aid for Innovative Collaborative Research Projects from Keio University, Japan.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - This paper describes an analytical platform to investigate the cell response against mechanical stimuli in in vitro 3D tissues. The system is capable of live-imaging cells in 3D tissues at a single cell level under mechanical stimuli, which makes this system similar to the in vivo environment and suitable for analysis of maturation mechanism. We succeeded in imaging various shapes of cells in 3D tissue under mechanical stimuli and observed that the stretch-induced deformation was distributed non-uniformly inside cells. We believe that our system could contribute to a further understanding of the tissue maturation mechanism induced by mechanical stimuli, which is highly useful for the development of tissue reconstruction.
AB - This paper describes an analytical platform to investigate the cell response against mechanical stimuli in in vitro 3D tissues. The system is capable of live-imaging cells in 3D tissues at a single cell level under mechanical stimuli, which makes this system similar to the in vivo environment and suitable for analysis of maturation mechanism. We succeeded in imaging various shapes of cells in 3D tissue under mechanical stimuli and observed that the stretch-induced deformation was distributed non-uniformly inside cells. We believe that our system could contribute to a further understanding of the tissue maturation mechanism induced by mechanical stimuli, which is highly useful for the development of tissue reconstruction.
KW - Mechanical stimuli
KW - Optical imaging
KW - PDMS
KW - Single cell analysis
KW - Tissue maturation
UR - http://www.scopus.com/inward/record.url?scp=85071920208&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071920208&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2019.8808445
DO - 10.1109/TRANSDUCERS.2019.8808445
M3 - Conference contribution
AN - SCOPUS:85071920208
T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
SP - 413
EP - 416
BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Y2 - 23 June 2019 through 27 June 2019
ER -