Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov, Feier Cao, Benjamin Tag, Gemma Liu, Cedric Caremel, Kai Steven Kunze

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)


This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

Original languageEnglish
Title of host publicationISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
PublisherAssociation for Computing Machinery
Number of pages8
ISBN (Electronic)9781450359672
Publication statusPublished - 2018 Oct 8
Event22nd International Symposium on Wearable Computers, ISWC 2018 - Singapore, Singapore
Duration: 2018 Oct 82018 Oct 12


Other22nd International Symposium on Wearable Computers, ISWC 2018


  • Haptics
  • Shape Memory Alloys.
  • Soft Robotics
  • Wearable Devices

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Computer Networks and Communications

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