Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov; Feier Cao; Benjamin Tag; Gemma Liu; Cedric Caremel; Kai Steven Kunze

doi:10.1145/3267242.3267257

Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov, Feier Cao, Benjamin Tag, Gemma Liu, Cedric Caremel, Kai Steven Kunze

Graduate School of Media Design

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Citations (Scopus)

Abstract

This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

Original language	English
Title of host publication	ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
Publisher	Association for Computing Machinery
Pages	112-119
Number of pages	8
ISBN (Electronic)	9781450359672
DOIs	https://doi.org/10.1145/3267242.3267257
Publication status	Published - 2018 Oct 8
Event	22nd International Symposium on Wearable Computers, ISWC 2018 - Singapore, Singapore Duration: 2018 Oct 8 → 2018 Oct 12

Other

Other	22nd International Symposium on Wearable Computers, ISWC 2018
Country	Singapore
City	Singapore
Period	18/10/8 → 18/10/12

Keywords

Haptics
Shape Memory Alloys.
Soft Robotics
Wearable Devices

ASJC Scopus subject areas

Software
Hardware and Architecture
Computer Networks and Communications

Access to Document

10.1145/3267242.3267257

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Cite this

Shape memory alloy wire actuators for soft, wearable haptic devices. / Chernyshov, George; Cao, Feier; Tag, Benjamin; Liu, Gemma; Caremel, Cedric; Kunze, Kai Steven.

ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, 2018. p. 112-119.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Chernyshov, G, Cao, F, Tag, B, Liu, G, Caremel, C & Kunze, KS 2018, Shape memory alloy wire actuators for soft, wearable haptic devices. in ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, pp. 112-119, 22nd International Symposium on Wearable Computers, ISWC 2018, Singapore, Singapore, 18/10/8. https://doi.org/10.1145/3267242.3267257

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abstract = "This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.",

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