Simultaneous 6-Gb/s data and 10-mW power transmission using nested clover coils for noncontact memory card

Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

An inductive power and data transmission link for a noncontact memory card interface is reported. Nested clover coils improve signal-to-interference ratio and enable simultaneous power and data transmission. This capability is then used in the design of a closed-loop feedback system for improving power transfer efficiency. Interference cancellation mechanism is analyzed with both 3-D EM simulations and a newly developed compact model of coupled inductors. Performance of the proposed solutions was confirmed experimentally using a scaled-down stacked-chip prototype fabricated in a 65-nm CMOS process. Maximum data transmission rate is 6 Gb/s and the total power transfer efficiency is 5.2%-10.2% over a load resistance range of 0.1-2 k$\Omega$.

Original languageEnglish
Article number6247481
Pages (from-to)2484-2495
Number of pages12
JournalIEEE Journal of Solid-State Circuits
Volume47
Issue number10
DOIs
Publication statusPublished - 2012

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Power transmission
Data communication systems
Data storage equipment
Interfaces (computer)
Telecommunication links
Feedback

Keywords

  • Analytical models
  • data communication
  • electromagnetic modeling
  • inductive power transmission
  • nonvolatile memory
  • power system stability

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Simultaneous 6-Gb/s data and 10-mW power transmission using nested clover coils for noncontact memory card. / Radecki, Andrzej; Yuan, Yuxiang; Miura, Noriyuki; Aikawa, Iori; Take, Yasuhiro; Ishikuro, Hiroki; Kuroda, Tadahiro.

In: IEEE Journal of Solid-State Circuits, Vol. 47, No. 10, 6247481, 2012, p. 2484-2495.

Research output: Contribution to journalArticle

Radecki, Andrzej ; Yuan, Yuxiang ; Miura, Noriyuki ; Aikawa, Iori ; Take, Yasuhiro ; Ishikuro, Hiroki ; Kuroda, Tadahiro. / Simultaneous 6-Gb/s data and 10-mW power transmission using nested clover coils for noncontact memory card. In: IEEE Journal of Solid-State Circuits. 2012 ; Vol. 47, No. 10. pp. 2484-2495.
@article{d6e1e1898f9043ae9233a3913a7ab0a0,
title = "Simultaneous 6-Gb/s data and 10-mW power transmission using nested clover coils for noncontact memory card",
abstract = "An inductive power and data transmission link for a noncontact memory card interface is reported. Nested clover coils improve signal-to-interference ratio and enable simultaneous power and data transmission. This capability is then used in the design of a closed-loop feedback system for improving power transfer efficiency. Interference cancellation mechanism is analyzed with both 3-D EM simulations and a newly developed compact model of coupled inductors. Performance of the proposed solutions was confirmed experimentally using a scaled-down stacked-chip prototype fabricated in a 65-nm CMOS process. Maximum data transmission rate is 6 Gb/s and the total power transfer efficiency is 5.2{\%}-10.2{\%} over a load resistance range of 0.1-2 k$\Omega$.",
keywords = "Analytical models, data communication, electromagnetic modeling, inductive power transmission, nonvolatile memory, power system stability",
author = "Andrzej Radecki and Yuxiang Yuan and Noriyuki Miura and Iori Aikawa and Yasuhiro Take and Hiroki Ishikuro and Tadahiro Kuroda",
year = "2012",
doi = "10.1109/JSSC.2012.2204545",
language = "English",
volume = "47",
pages = "2484--2495",
journal = "IEEE Journal of Solid-State Circuits",
issn = "0018-9200",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "10",

}

TY - JOUR

T1 - Simultaneous 6-Gb/s data and 10-mW power transmission using nested clover coils for noncontact memory card

AU - Radecki, Andrzej

AU - Yuan, Yuxiang

AU - Miura, Noriyuki

AU - Aikawa, Iori

AU - Take, Yasuhiro

AU - Ishikuro, Hiroki

AU - Kuroda, Tadahiro

PY - 2012

Y1 - 2012

N2 - An inductive power and data transmission link for a noncontact memory card interface is reported. Nested clover coils improve signal-to-interference ratio and enable simultaneous power and data transmission. This capability is then used in the design of a closed-loop feedback system for improving power transfer efficiency. Interference cancellation mechanism is analyzed with both 3-D EM simulations and a newly developed compact model of coupled inductors. Performance of the proposed solutions was confirmed experimentally using a scaled-down stacked-chip prototype fabricated in a 65-nm CMOS process. Maximum data transmission rate is 6 Gb/s and the total power transfer efficiency is 5.2%-10.2% over a load resistance range of 0.1-2 k$\Omega$.

AB - An inductive power and data transmission link for a noncontact memory card interface is reported. Nested clover coils improve signal-to-interference ratio and enable simultaneous power and data transmission. This capability is then used in the design of a closed-loop feedback system for improving power transfer efficiency. Interference cancellation mechanism is analyzed with both 3-D EM simulations and a newly developed compact model of coupled inductors. Performance of the proposed solutions was confirmed experimentally using a scaled-down stacked-chip prototype fabricated in a 65-nm CMOS process. Maximum data transmission rate is 6 Gb/s and the total power transfer efficiency is 5.2%-10.2% over a load resistance range of 0.1-2 k$\Omega$.

KW - Analytical models

KW - data communication

KW - electromagnetic modeling

KW - inductive power transmission

KW - nonvolatile memory

KW - power system stability

UR - http://www.scopus.com/inward/record.url?scp=84867401888&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84867401888&partnerID=8YFLogxK

U2 - 10.1109/JSSC.2012.2204545

DO - 10.1109/JSSC.2012.2204545

M3 - Article

AN - SCOPUS:84867401888

VL - 47

SP - 2484

EP - 2495

JO - IEEE Journal of Solid-State Circuits

JF - IEEE Journal of Solid-State Circuits

SN - 0018-9200

IS - 10

M1 - 6247481

ER -