Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

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118 Citations (Scopus)

Abstract

We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.

Original languageEnglish
Pages (from-to)1856-1859
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume43
Issue number4 B
Publication statusPublished - 2004 Apr
Externally publishedYes

Fingerprint

Ohmic contacts
electric contacts
Carbon nanotubes
titanium
Titanium
carbon nanotubes
Electrodes
electrodes
low resistance
Nickel
nickel
catalysts
titanium carbides
Titanium carbide
Catalysts
Contact resistance
contact resistance
bundles
Chemical vapor deposition
filaments

Keywords

  • Carbon nanotube
  • Hot-filament CVD
  • Interconnect
  • Ohmic contact
  • Titanium carbide
  • Via

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

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abstract = "We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.",
keywords = "Carbon nanotube, Hot-filament CVD, Interconnect, Ohmic contact, Titanium carbide, Via",
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T1 - Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects

AU - Nihei, Mizuhisa

AU - Horibe, Masahiro

AU - Kawabata, Akio

AU - Awano, Yuji

PY - 2004/4

Y1 - 2004/4

N2 - We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.

AB - We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.

KW - Carbon nanotube

KW - Hot-filament CVD

KW - Interconnect

KW - Ohmic contact

KW - Titanium carbide

KW - Via

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