Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

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We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.

Original languageEnglish
Pages (from-to)1856-1859
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Issue number4 B
Publication statusPublished - 2004 Apr
Externally publishedYes



  • Carbon nanotube
  • Hot-filament CVD
  • Interconnect
  • Ohmic contact
  • Titanium carbide
  • Via

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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