Abstract
A La2O3 gate insulator was prepared via LaOF on a silicon substrate to suppress the interface reaction between the gate insulator and silicon substrate. LaOF was formed by heating the precursor solution containing La(NO3)3, acetylacetone and trifluoroacetic acid at 400-700°C in N2. By heating LaOF film at 700°C for 30 min in air, fluorine eliminated completely and La2O3 was formed. But silicon-oxide was formed at interface between LaOF heated at 400°C in N2 and the silicon substrate. To suppress the interface reaction, preparation of the fluoride on silicon will be needed.
Original language | English |
---|---|
Pages (from-to) | 259-262 |
Number of pages | 4 |
Journal | Key Engineering Materials |
Volume | 228-229 |
Publication status | Published - 2002 Jan 1 |
Event | Asian Ceramic Science for Electronics II Proceedings of the 2nd Asian Meeting of Electroceramics - Kawasaki, Japan Duration: 2001 Oct 1 → 2001 Oct 1 |
Keywords
- Fluoride
- Lanthanum Oxide
- Oxyfluoride
- Thin Film
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering